Datasheet > HCM1012GD900B05P

HCM1012GD900B05P

更新时间： 2022-02-26 11:37:39

品牌	Logo	应用领域
优恩 - UNSEMI		/
页数	文件大小	规格书
6页	1212K
描述
LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification

阅读下载

获取价格

如果您发现信息不准确，欢迎纠错

HCM1012GD900B05P 数据手册

LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification

HCM1012G Series

REEL DIMENSIONS

STANDARD QUANTITY FOR PACKAGING

Packaging style : Taping

Reel packaging quantity : 4000 pcs/reel

Inner box : 5 reel/inner box

RECOMMENDED SOLDERING CONDITIONS

GENERAL TECHNICAL DATA

Opertation temperatur range : -40℃ ~ +85℃

Storage Condition : Less than 40℃ and 70% RH

Storage Time: 6 months Max.

Soldering method: Reflow or Wave Soldering

UN Semiconductor Co., Ltd.

www.unsemi.com.tw

@ UN Semiconductor Co., Ltd. 2014

Revision December 18, 2014

5 / 6

Specifications are subject to change without notice.

1 2 3 456

下载PDF

型号	品牌	描述	获取价格	数据表
HCM1012GH	UNSEMI	HCM1012GH Series	获取价格
HCM1012GH900A05P	UNSEMI	LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification	获取价格
HCM1012GS500A 05P	UNSEMI	HCM1012GS500A 05P	获取价格
HCM1012GS670A05P	UNSEMI	HCM1012GS670A05P	获取价格
HCM10DRAH	ETC	CONN EDGE DUAL FMALE 20POS 0.156	获取价格
HCM10DRAI	ETC	CONN EDGE DUAL FMALE 20POS 0.156	获取价格