Datasheet > HCM1012GD900B05P

HCM1012GD900B05P

更新时间： 2024-01-15 12:07:32

品牌	Logo	应用领域
优恩 - UNSEMI		/
页数	文件大小	规格书
6页	1212K
描述
LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification

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HCM1012GD900B05P 数据手册

LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification

HCM1012G Series

RELIABILITY AND TEST CONDITION

Test item

Test condition

A. Temperature : -40 ~ +85℃

B. Cycle : 100 cycles

Criteria

A. No mechanical damage

B.Impedance value should be

within ± 20 % of the initial value

C. Dwell time : 30minutes

Measurement : at ambient

temperature 24 hrs after test

completion

Temperature Cycle

A. Temperature : 85℃ ± 5℃

B. Test time : 1000 hrs

A. No mechanical damage

B.Impedance value should be

within ± 20 % of the initial value

C. Apply current : full rated current

Measurement : at ambient

temperature 24 hrs after test

completion

Operational Life

A. Temperature : 40 ± 2℃

B. Humidity : 90 ~ 95 % RH

C. Test time : 1000 hrs

A. No mechanical damage

B. Impedance value should be

within ± 20 % of the initial value

D. Apply current : full rated current

Measurement : at ambient

temperature 24 hrs after test

completion

Biased Humidity

A. Solder temperature : 260 ± 5℃

B. Flux : Rosin

A. More than 95 % of terminal

electrode should be covered

with new solder

C. DIP time : 10 ± 1 sec

Resistance to Solder

Heat

B. No mechanical damage

C.Impedance value should be

within ± 20 % of the initial value

A. Temperature : 93 ± 2℃

B. Test time : 4 hrs

More than 95 % of terminal

electrode should be covered with

new solder

C. Solder temperature : 235 ± 5℃

D. Flux : Rosin

Steam Aging Test

E. DIP time : 5 ± 1 sec

UN Semiconductor Co., Ltd.

www.unsemi.com.tw

@ UN Semiconductor Co., Ltd. 2014

Revision December 18, 2014

6 / 6

Specifications are subject to change without notice.

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