Datasheet > H03N60

H03N60

更新时间： 2024-01-25 01:21:34

品牌	Logo	应用领域
HSMC		晶体晶体管功率场效应晶体管
页数	文件大小	规格书
5页	59K
描述
N-Channel Power Field Effect Transistor

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技术参数
数据手册

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H03N60 技术参数

生命周期：	Obsolete	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.84
Is Samacsys：	N	Base Number Matches：	1

H03N60 数据手册

Spec. No. : MOS200602

Issued Date : 2006.02.01

Revised Date : 2006.02.07

Page No. : 4/5

HI-SINCERITY

MICROELECTRONICS CORP.

TO-220AB Dimension

DIM

Min.

5.58

8.38

4.40

1.15

0.35

2.03

9.66

Max.

7.49

8.90

4.70

1.39

0.60

2.92

10.28

*16.25

*3.83

4.00

0.95

3.42

1.40

*2.54

14.27

15.87

Marking:

Pb Free Mark

(Note)

Pb-Free: " . "

Normal: None

0 3 N 6 0

Date Code

Control Code

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2 & Tab.Drain 3.Source

3.00

0.75

2.54

1.14

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

Tab

12.70

14.48

*: Typical, Unit: mm

3-Lead TO-220AB

Plastic Package

HSMC Package Code: E

TO-220FP Dimension

DIM

Min.

6.48

4.40

2.34

0.45

9.80

3.10

2.70

0.60

2.34

12.48

15.67

0.90

2.00

Max.

7.40

4.90

3.00

0.80

10.36

3.60

3.43

1.00

2.74

13.60

16.20

1.47

2.96

*5^o

Marking:

Pb Free Mark

α4

α1

(Note)

Pb-Free: " . "

Normal: None

0 3 N 6 0

α3

α2

α5

Date Code

Control Code

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2.Drain 3.Source

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

α1/2/4/5

α3

*27^o

*: Typical, Unit: mm

3-Lead TO-220FP

Plastic Package

HSMC Package Code: F

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-2521-2056 Fax: 886-2-2563-2712

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-598-3621~5 Fax: 886-3-598-2931

H03N60E, H03N60F

HSMC Product Specification

1 2 345

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