Spec. No. : MOS200602
Issued Date : 2006.02.01
Revised Date : 2006.02.07
Page No. : 1/5
HI-SINCERITY
MICROELECTRONICS CORP.
H03N60 Series Pin Assignment
H03N60 Series
Tab
N-Channel Power Field Effect Transistor
3-Lead Plastic TO-220AB
Package Code: E
Pin 1: Gate
Pin 2 & Tab: Drain
Pin 3: Source
Description
3
This high voltage MOSFET uses an advanced termination scheme to
provide enhanced voltage-blocking capability without degratding
performance over time. In addition, this advanced MOSFET is designed to
withstand high energy in avalanche and commutation modes. The new
energy efficient design also offers a drain-to-source diode with a fast
recovery time. Designed for high voltage, high speed switching
applications in power supplies, converters and PWM motor controls,
these devices are particularly well suited for bridge circuits where diode
speed and commutating safe operating areas are critical and offer
additional and saafety margin against unexpected voltage transients.
2
1
3-Lead Plastic TO-220FP
Package Code: F
Pin 1: Gate
Pin 2: Drain
Pin 3: Source
3
D
2
1
H03N60 Series
Symbol:
G
Features
S
• Robust High Voltage Termination
• Avalanc he Energy Specified
• Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature
Absolute Maximum Ratings
Symbol
ID
Parameter
Drain to Current (Continuous)
Value
3
Units
A
IDM
Drain to Current (Pulsed)
12
A
VGS
Gate-to-Source Voltage (Continue)
Total Power Dissipation (TC=25oC)
H03N60E (TO-220AB)
V
±30
55
28
W
H03N60F (TO-220FP)
PD
Derate above 25°C
0.4
0.33
H03N60E (TO-220AB)
W/°C
H03N60F (TO-220FP)
Tj, Tstg
EAS
Operating and Storage Temperature Range
-55 to 150
°C
Single Pulse Drain-to-Source Avalanche Enrgy-Tj=25°C
(VDD=100V, VGS=10V, IL=2A, L=10mH, RG=25Ω)
35
mJ
Maximum Lead Temperature for Soldering Purposes, 1/8”
from case for 10 seconds
TL
260
°C
H03N60E, H03N60F
HSMC Product Specification