TaNFilm® Small Outline Surface
Mount Resistor Network
IRC Advanced Film Division
Ultra precision tantalum
nitride resistance element
on high purity alumina.
Rugged, molded
construction.
GUB Series
Compliant leads to
compensate for
thermal expansion
and contractions.
• Thin film on ceramic technology
• 0.220” and 0.300” sizes available
• RoHS compliant version available
• DESC 87012 and 87013 available
• Standard JEDEC packages for automatic placement equipment
IRC’s TaNFilm®, Small Outline Integrated Circuit resistor networks are ideally suited for surface mounting.
The 0.05 inch lead spacing provides higher lead density, increased component count, lower installed resistor
cost, and better reliability. They are ideally suited for the latest surface mount assembly techniques, and each
lead can be 100% visually inspected. The compliant leads relieve thermal expansion and contraction stressed
created by soldering and temperature excursions.
The tantalum nitride film system provides precision tolerance, exceptional TCR tracking, and low noise.
TaNFilm® provides stability, high reliability, and long life characteristics. Testing has demonstrated performance
exceeding MIL-PRF-83401 characteristics H.
Electrical Data
GM Type
GL Type
Schem A: 10 to 150K
Schem A: 10 to 200K
Schem B: 10 to 75K
Schem B: 10 to 1000K
Resistance Range (Ω)
Absolute Tolerance
Ratio Tolerance To R1
TCR (ppm/°C)
Available to ±0.1%
Available to ±0.05%
±25, ±50, ±100
±5
TCR Tracking To R1 (ppm°C)
Operating Temperature Range
Noise
-55°C to +125°C
Less than -25 dB
Substrate
High purity alumina substrate
Custom circuits and special testing available.
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
GUB Series Issue November 2008 Sheet 1 of 3