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GT28F160B3-B120 PDF预览

GT28F160B3-B120

更新时间: 2024-11-17 22:07:03
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
49页 426K
描述
SMART 3 ADVANCED BOOT BLOCK WORD-WIDE

GT28F160B3-B120 数据手册

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PRELIMINARY  
E
SMART 3 ADVANCED BOOT BLOCK  
WORD-WIDE  
4-MBIT (256K X 16), 8-MBIT (512K X 16),  
16-MBIT (1024K X 16)  
FLASH MEMORY FAMILY  
28F400B3, 28F800B3, 28F160B3  
Flexible SmartVoltage Technology  
2.7V–3.6V Program/Erase  
Supports Code Plus Data Storage  
Optimized for FDI, Flash Data  
Integrator Software  
2.7V–3.6V Read Operation  
12V VPP Fast Production  
Programming  
Fast Program Suspend Capability  
Fast Erase Suspend Capability  
2.7V or 1.8V I/O Option  
Extended Cycling Capability  
10,000 Block Erase Cycles  
Reduces Overall System Power  
Optimized Block Sizes  
Eight 4-KW Blocks for Data,  
Top or Bottom Locations  
Up to Thirty-One 32-KW Blocks for  
Code  
Automated Word Program and Block  
Erase  
Command User Interface  
Status Registers  
SRAM-Compatible Write Interface  
Automatic Power Savings Feature  
High Performance  
2.7V–3.6V: 120 ns Max Access Time  
Reset/Deep Power-Down  
1 µA ICCTypical  
Block Locking  
VCC-Level Control through WP#  
Spurious Write Lockout  
Low Power Consumption  
Standard Surface Mount Packaging  
48-Ball µBGA* Package  
20 mA Maximum Read Current  
Absolute Hardware-Protection  
VPP = GND Option  
48-Lead TSOP Package  
Footprint Upgradeable  
Upgradeable from 2-, 4- and 8-Mbit  
Boot Block  
VCC Lockout Voltage  
Extended Temperature Operation  
–40°C to +85°C  
ETOX™ V (0.4 µ) Flash Technology  
The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-  
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability  
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been  
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and  
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.  
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,  
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Word-Wide  
products will be available in 48-lead TSOP and 48-ball µBGA* packages. Additional information on this  
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp.  
May 1997  
Order Number: 290580-002  

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