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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| GT9926NW | ETC |
获取价格 |
Mini size of Discrete semiconductor elements |
|
| GT9P-12P-2.54DS | HRS |
获取价格 |
Board Connector, 12 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, |
|
| GT9P-12P-2.54DSA | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
| GT9P-12P-2.54DSA(05) | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
| GT9P-12P-2.54DSA(12) | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
| GT9P-12P-2.54DSA(13) | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
| GT9P-12P-2.54DSA(72) | HRS |
获取价格 |
Board Connector, 12 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, ROHS COMPLIANT |
|
| GT9P-12P-2.54DSA05 | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
| GT9P-12P-2.54DSA12 | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
| GT9P-12P-2.54DSA13 | HRS |
获取价格 |
Developed for Equipment Exposed to Harsh Environmental Conditions |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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