是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LBGA, BGA165,11X15,40 |
针数: | 165 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.B | HTS代码: | 8542.32.00.41 |
Factory Lead Time: | 12 weeks | 风险等级: | 5.92 |
最长访问时间: | 0.45 ns | 其他特性: | PIPELINED ARCHITECTURE |
最大时钟频率 (fCLK): | 450 MHz | I/O 类型: | SEPARATE |
JESD-30 代码: | R-PBGA-B165 | 长度: | 15 mm |
内存密度: | 75497472 bit | 内存集成电路类型: | QDR SRAM |
内存宽度: | 18 | 功能数量: | 1 |
端子数量: | 165 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 4MX18 | 输出特性: | 3-STATE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装等效代码: | BGA165,11X15,40 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE | 并行/串行: | PARALLEL |
电源: | 1.5,1.8 V | 认证状态: | Not Qualified |
座面最大高度: | 1.4 mm | 最小待机电流: | 1.7 V |
子类别: | SRAMs | 最大压摆率: | 1.51 mA |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 13 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
GS8672Q20BE-500 | GSI |
获取价格 |
On-Chip ECC with virtually zero SER | |
GS8672Q20BE-500I | GSI |
获取价格 |
On-Chip ECC with virtually zero SER | |
GS8672Q20BGE-400 | GSI |
获取价格 |
On-Chip ECC with virtually zero SER | |
GS8672Q20BGE-400I | GSI |
获取价格 |
On-Chip ECC with virtually zero SER | |
GS8672Q20BGE-450 | GSI |
获取价格 |
On-Chip ECC with virtually zero SER | |
GS8672Q20BGE-450I | GSI |
获取价格 |
On-Chip ECC with virtually zero SER | |
GS8672Q20BGE-500 | GSI |
获取价格 |
On-Chip ECC with virtually zero SER | |
GS8672Q20BGE-500I | GSI |
获取价格 |
On-Chip ECC with virtually zero SER | |
GS8672Q36AE-200 | GSI |
获取价格 |
Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 | |
GS8672Q36AE-200I | GSI |
获取价格 |
Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FBGA-165 |