Datasheet > GRM21BR71C334JA01K

GRM21BR71C334JA01K

更新时间： 2022-10-12 14:42:47

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
30页	828K
描述
Chip Monolithic Ceramic Capacitor for General

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Notice

2. Land Dimensions

Chip Capacitor

2-1. Chip capacitors can be cracked due to the stress

of PCB bending , etc. if the land area is larger than

needed and has an excess amount of solder.

Please refer to the land dimensions in table 1

for flow soldering, table 2 for reflow soldering.

Land

Please confirm the suitable land dimension by

evaluating of the actual SET / PCB.

Solder Resist

Table 1 Flow Soldering Method

ChipꢀDimension

(L/W)ꢀCode

Series

GRM

Chip(L×W)

1.6×0.8

2.0×1.25

3.2×1.6

0.6 to 1.0

1.0 to 1.2

2.2 to 2.6

0.8 to 0.9

0.9 to 1.0

1.0 to 1.1

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.

(in mm)

Table 2 Reflow Soldering Method

Chip(L×W)

(Dimensions

Tolerance)

ChipꢀDimension

(L/W)ꢀCode

Series

GRM

0.25×0.125

0.10 to 0.11

0.07 to 0.12

0.125 to 0.145

GRM

0.4×0.2

0.6×0.3

0.16 to 0.2

0.2 to 0.3

0.3 to 0.5

0.4 to 0.6

0.6 to 0.8

0.7 to 0.9

1.2

0.12 to 0.18

0.2 to 0.35

0.35 to 0.45

0.4 to 0.5

0.6 to 0.7

0.7 to 0.8

0.6

0.2 to 0.23

0.2 to 0.4

0.4 to 0.6

0.5 to 0.7

0.6 to 0.8

0.8 to 1.0

1.25

1.0×0.5

(within ±0.10)

1.0×0.5

（±0.15/±0.20）

1.6×0.8

(within ±0.10)

1.6×0.8

(±0.15/±0.20)

2.0×1.25

(within ±0.10)

2.0×1.25

(±0.15)

2.0×1.25

GRM

1.2

0.6 to 0.8

0.9 to 1.2

1.0 to 1.3

1.0 to 1.2

1.2 to 1.4

1.4 to 1.6

1.2 to 1.4

1.5 to 1.7

1.7 to 1.9

1.8 to 2.3

2.3 to 3.0

3.5 to 4.8

1.0 to 1.4

1.8 to 2.0

1.9 to 2.1

2.0 to 2.4

3.0 to 3.5

4.0 to 4.6

(±0.20)

3.2×1.6

(within±0.20)

3.2×1.6

(±0.30)

GRM

3.2×2.5

4.5×3.2

5.7×5.0

(in mm)

JEMCGC-2701X

1...23 24 252627 28 29 30

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