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GRM21BR71C334JA01K PDF预览

GRM21BR71C334JA01K

更新时间： 2022-10-12 14:42:47
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
30页 828K
描述
Chip Monolithic Ceramic Capacitor for General

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中文翻译

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GRM21BR71C334JA01K 数据手册

 浏览型号GRM21BR71C334JA01K的Datasheet PDF文件第22页浏览型号GRM21BR71C334JA01K的Datasheet PDF文件第23页浏览型号GRM21BR71C334JA01K的Datasheet PDF文件第24页浏览型号GRM21BR71C334JA01K的Datasheet PDF文件第26页浏览型号GRM21BR71C334JA01K的Datasheet PDF文件第27页浏览型号GRM21BR71C334JA01K的Datasheet PDF文件第28页 
Notice  
■Soldering and Mounting  
1.PCB Design  
1. Notice for Pattern Forms  
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted  
directly on the substrate.  
They are also more sensitive to mechanical and thermal stresses than leaded components.  
Excess solder fillet height can multiply these stresses and cause chip cracking.  
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility  
of excess solder fillet height.  
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress  
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient  
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to  
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit  
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.  
Pattern Forms  
Prohibited  
Correct  
Chassis  
Solder Resist  
Solder (ground)  
Placing Close to Chassis  
Electrode Pattern  
Lead Wire  
in section  
in section  
in section  
in section  
Solder Resist  
Placing of Chip  
Components  
and Leaded  
Components  
in section  
Soldering Iron  
Lead Wire  
Placing of Leaded  
Components  
after Chip Component  
Solder Resist  
in section  
Solder Resist  
Lateral Mounting  
JEMCGC-2701X  
25  
1...22232425262728...30

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