Datasheet > GRM1555C1E150GA01

GRM1555C1E150GA01

更新时间： 2022-12-29 21:09:50

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
30页	838K
描述
Chip Monolithic Ceramic Capacitor for General

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GRM1555C1E150GA01 数据手册

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Substrate Bending test

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ: Solder resist

(Coat with heat resistant resin for solder)

Land

Dimension (mm)

f4.5

Type

GRM02

GRM03

GRM15

GRM18

GRM21

GRM31

GRM32

0.2

0.3

0.4

1.0

1.2

2.2

0.56

0.9

1.5

3.0

4.0

5.0

0.23

0.3

0.5

1.2

1.65

2.0

2.9

100

Fig.1

Kind of Solder : Sn-3.0Ag-0.5Cu

Pressurization method

(in mm)

・

Pressurization

speed

1.0mm/s

50 min.

Pressurize

Flexure:≦1

Capacitance meter

45 45

Fig.2

(in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material

: Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

Kind of Solder : Sn-3.0Ag-0.5Cu

Land Dimensions

・

Chip Capacitor

Dimension (mm)

Type

Land

GRM02

GRM03

GRM15

GRM18

GRM21

GRM31

GRM32

0.2

0.3

0.4

1.0

1.2

2.2

0.56

0.9

1.5

3.0

4.0

5.0

0.23

0.3

0.5

1.2

1.65

2.0

2.9

Solder Resist

Fig.3

JEMCGS-0015S

1 2 3 456 7 8...30

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