Datasheet > GRM1555C1E150GA01

GRM1555C1E150GA01

更新时间： 2022-12-29 21:09:50

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
30页	838K
描述
Chip Monolithic Ceramic Capacitor for General

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Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Item

Specification

10 Vibration

Appearance No defects or abnormalities.

Capacitance Within the specified initial value.

Within the specified initial value.

Solder the capacitor on the test substrate shown in Fig.3.

Kind of Vibration

Total amplitude

A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

: 1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate

Bending test

Appearance No defects or abnormalities.

Capacitance Within +/-5% or +/-0.5pF

Solder the capacitor on the test substrate shown in Fig.1.

Pressurization method : Shown in Fig.2

Change

(Whichever is larger)

Flexureꢀ

ꢀꢀꢀ: 1mm

Holding Time

Soldering Method

5+/-1s

Reflow soldering

12 Solderability

Test Method

Flux

Solder bath method

Solution of rojin ethanol 25(wt)%

80℃ to 120℃ for 10s to 30s

Sn-3.0Ag-0.5Cu

95% of the terminations is to be soldered evenly and continuously.

Preheat

Solder

Solder Temp.

Immersion time

: 245+/-5℃

: 2+/-0.5s

13 Resistance to

Appearance No defects or abnormalities.

Test Method

Solder

Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF

Solder bath method

Sn-3.0Ag-0.5Cu

270+/-5℃

Change

(Whichever is larger)

Solder Temp.

Immersion time

Exposure Time

Preheat

Within the specified initial value.

: 10+/-0.5s

24+/-2h

I.R.

GRM31 size max.: 120℃ to 150℃ for 1 min

GRM32 size ꢀꢀ : 100℃ to 120℃ for 1 min

and 170℃ to 200℃ for 1 min

ꢀ

Voltage proof No defects.

Test Method

Solder

Reflow soldering (hot plate)

Sn-3.0Ag-0.5Cu

270+/-5℃

Solder Temp.

Reflow Time

Test Substrate

Exposure Time

Preheat

10+/-0.5s

Glass epoxy PCB

24+/-2h

120℃ to 150℃ for 1 min

Appearance No defects or abnormalities.

Capacitance Within +/-2.5% or+/- 0.25pF

Solder the capacitor on the test substrate shown in Fig.3.

Temperature

Sudden Change

Change

(Whichever is larger)

Perform the five cycles according to the four heat treatments

shown in the following table.

Within the specified initial value.

Step

Temp.(C)

Min.Operating Temp.+0/-3

Room Temp.

Time (min)

30+/-3

2 to 3

I.R.

Voltage proof No defects.

30+/-3

2 to 3

Max.Operating Temp.+3/-0

Room Temp

Exposure Time

: 24+/-2h

JEMCGS-0015S

1 234 5 6 7...30

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