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GRM0225C1C6R1CA03# PDF预览

GRM0225C1C6R1CA03#

更新时间: 2023-09-03 20:40:20
品牌 Logo 应用领域
村田 - MURATA 医疗医疗器械
页数 文件大小 规格书
31页 1860K
描述
民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备]

GRM0225C1C6R1CA03# 数据手册

 浏览型号GRM0225C1C6R1CA03#的Datasheet PDF文件第2页浏览型号GRM0225C1C6R1CA03#的Datasheet PDF文件第3页浏览型号GRM0225C1C6R1CA03#的Datasheet PDF文件第4页浏览型号GRM0225C1C6R1CA03#的Datasheet PDF文件第6页浏览型号GRM0225C1C6R1CA03#的Datasheet PDF文件第7页浏览型号GRM0225C1C6R1CA03#的Datasheet PDF文件第8页 
Table A Capacitance Change between at Reference Temp. and at each Temp. (%)  
-55℃  
-30℃  
-10℃  
Char.  
5C  
Max.  
0.58  
Min.  
-0.24  
Max.  
0.4  
Min.  
-0.17  
Max.  
0.25  
Min.  
-0.11  
Substrate Bending test  
Except for Substrate Bending test  
Test substrate  
Material  
Thickness  
Test substrate  
Material  
Thickness  
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)  
0.8mm  
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)  
1.6mm or 0.8mm  
Copper Foil Thickness 0.012mm  
Copper Foil Thickness 0.012mm  
Kind of Solder  
Sn-3.0Ag-0.5Cu(Lead Free Solder)  
Kind of Solder  
Sn-3.0Ag-0.5Cu(Lead Free Solder)  
Land Dimension  
Land Dimension  
Dimension(mm)  
b
Dimension(mm)  
b
Type  
Type  
a
c
a
c
GRM02  
0.2  
0.56  
0.23  
GRM02  
0.2  
0.56  
0.23  
Pressurization Method  
GRM0225C1C6R1CA03-01A  
5

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