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GNM1M2R71H102MA01 PDF预览

GNM1M2R71H102MA01

更新时间: 2024-02-04 05:05:58
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
24页 602K
描述
CHIP MONOLITHIC CERAMIC CAPACITOR, CAPACITOR ARRAYS FOR GENERAL

GNM1M2R71H102MA01 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:CHIP,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8532.25.00.45风险等级:5.79
电容:0.001 µF电容器类型:ARRAY/NETWORK CAPACITOR
JESD-609代码:e3长度:1.37 mm
安装特点:SURFACE MOUNT负容差:20%
网络类型:ISOLATED C NETWORK元件数量:1
功能数量:2端子数量:4
最高工作温度:125 °C最低工作温度:-55 °C
封装代码:CHIP封装形状:RECTANGULAR PACKAGE
包装方法:TR, PAPER, 7 INCH正容差:20%
额定(直流)电压(URdc):50 V座面最大高度:0.6 mm
表面贴装:YES温度特性代码:X7R
温度系数:15% ppm/ °C端子面层:Tin (Sn)
端子节距:0.64 mm端子形状:WRAPAROUND
宽度:1 mmBase Number Matches:1

GNM1M2R71H102MA01 数据手册

 浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第18页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第19页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第20页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第21页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第22页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第24页 
Notice  
2.Washing  
1. Please evaluate a capacitor by actual cleaning equipment and condition surely  
for confirming the quality and select the applicable solvent.  
2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of  
electrical characteristics and the reliability of the capacitors.  
3. Select the proper cleaning conditions.  
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the  
performance of the capacitors.  
3.Coating  
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during  
curing process.  
The stress is affected by the amount of resin and curing contraction.  
Select a resin with small curing contraction.  
The difference in the thermal expansion coefficient between a coating resin or a molding resin and  
capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and  
lead to the deterioration of insulation resistance or dielectric breakdown.  
Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.  
A silicone resin can be used as an under-coating to buffer against the stress.  
2. Select a resin that is less hygroscopic.  
Using hygroscopic resins under high humidity conditions may cause the deterioration of the  
insulation resistance of a capacitor.  
An epoxy resin can be used as a less hygroscopic resin.  
Others  
1.Transportation  
1. The performance of a capacitor may be affected by the conditions during transportation.  
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force  
during transportation.  
(1) Climatic condition  
low air temperature:-40℃  
change of temperature air/air:-25/25℃  
low air pressure30 kPa  
change of air pressure6 kPa/min  
(2) Mechanical condition  
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly  
passed on to the inner packaging.  
1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.  
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may  
occur in the ceramic body of the capacitor.  
(2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the  
surface of capacitor, the capacitor may crack and short-circuit.  
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.  
The capacitor dropped accidentally during processing may be damaged.  
JEMCCC-0010Q  
23  

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