5秒后页面跳转
捷配首页

Datasheet > GNM1M2R71H102MA01
GNM1M2R71H102MA01 PDF预览

GNM1M2R71H102MA01

更新时间： 2024-02-10 14:47:10
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
24页 602K
描述
CHIP MONOLITHIC CERAMIC CAPACITOR, CAPACITOR ARRAYS FOR GENERAL

阅读下载

中文翻译

获取价格

GNM1M2R71H102MA01 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：CHIP,
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.25.00.45风险等级：5.79
电容：0.001 µF电容器类型：ARRAY/NETWORK CAPACITOR
JESD-609代码：e3长度：1.37 mm
安装特点：SURFACE MOUNT负容差：20%
网络类型：ISOLATED C NETWORK元件数量：1
功能数量：2端子数量：4
最高工作温度：125 °C最低工作温度：-55 °C
封装代码：CHIP封装形状：RECTANGULAR PACKAGE
包装方法：TR, PAPER, 7 INCH正容差：20%
额定（直流）电压（URdc）：50 V座面最大高度：0.6 mm
表面贴装：YES温度特性代码：X7R
温度系数：15% ppm/ °C端子面层：Tin (Sn)
端子节距：0.64 mm端子形状：WRAPAROUND
宽度：1 mmBase Number Matches：1

GNM1M2R71H102MA01 数据手册

 浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第18页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第19页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第20页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第22页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第23页浏览型号GNM1M2R71H102MA01的Datasheet PDF文件第24页 
Notice  
■Soldering and Mounting  
1.PCB Design  
1. Notice for Pattern Forms  
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted  
directly on the substrate.  
They are also more sensitive to mechanical and thermal stresses than leaded components.  
Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,  
take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet  
height.  
1-2.There is a possibility of chip crack caused by PCB expansion/contraction with heat.  
Because stress for chip is different depend on PCB material and structure.Especially metal PCB  
such as alumina has a greater risk of chip crack because of large difference of thermal expansion coefficient.  
In case of chip below 0402 size, there is also the same possibility of crack with a single-layered glass epoxy  
board.  
Pattern Forms  
Prohibited  
Correct  
Chassis  
Solder (ground)  
Solder Resist  
Placing Close to Chassis  
Electrode Pattern  
Lead Wire  
Solder Resist  
Placing of Chip  
Components  
and Leaded Components  
Soldering Iron  
Lead Wire  
Solder Resist  
Placing of Leaded  
Components  
after Chip Component  
Solder Resist  
Lateral Mounting  
JEMCCC-0010Q  
21  
1...18192021222324

中文翻译

下载PDF

与GNM1M2R71H102MA01相关器件

型号 品牌 获取价格 描述 数据表
GNM1M2R71H102MA01D MURATA

获取价格

 		Array/Network Capacitor, 50V, X7R, 0.001uF, Surface Mount, CHIP-4, CHIP, ROHS COMPLIANT
GNM2145C1H100KA01B MURATA

获取价格

 		Array/Network Capacitor, 50V, C0G, 0.00001uF, Surface Mount, CHIP-8, CHIP
GNM2145C1H100KA01J MURATA

获取价格

 		Array/Network Capacitor, 50V, C0G, 0.00001uF, Surface Mount, CHIP-8, CHIP
GNM2145C1H100KD01 MURATA

获取价格

 		CHIP MONOLITHIC CERAMIC CAPACITOR
GNM2145C1H100KD01D MURATA

获取价格

 		Array/Network Capacitor, 50V, C0G, 0.00001uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT
GNM2145C1H101KD01 MURATA

获取价格

 		CHIP MONOLITHIC CERAMIC CAPACITOR
GNM2145C1H150KD01 MURATA

获取价格

 		CHIP MONOLITHIC CERAMIC CAPACITOR
GNM2145C1H150KD01D MURATA

获取价格

 		Array/Network Capacitor, 50V, C0G, 0.000015uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT
GNM2145C1H151KA01D MURATA

获取价格

 		Array/Network Capacitor, 50V, C0G, 0.00015uF, Surface Mount, CHIP-8, CHIP
GNM2145C1H151KD01 MURATA

获取价格

 		CHIP MONOLITHIC CERAMIC CAPACITOR

与GNM1M2R71H102MA01相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证