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GLZ4.7C-T/R PDF预览

GLZ4.7C-T/R

更新时间: 2023-01-03 08:02:50
品牌 Logo 应用领域
CHENG-YI /
页数 文件大小 规格书
4页 137K
描述
Zener Diode,

GLZ4.7C-T/R 数据手册

 浏览型号GLZ4.7C-T/R的Datasheet PDF文件第2页浏览型号GLZ4.7C-T/R的Datasheet PDF文件第3页浏览型号GLZ4.7C-T/R的Datasheet PDF文件第4页 
GLZ2.0~GLZ56  
PB FREE PRODUCT  
SURFACE MOUNT ZENER DIODES  
Unit : inch (mm)  
MINI-MELF/LL-34  
VOLTAGE  
POWER  
500 mWatts  
2.0 to 56 Volts  
FEATURES  
• Planar Die construction  
• 500mW Power Dissipation  
• Ideally Suited for Automated Assembly Processes  
MECHANICAL DATA  
• Case: Molded Glass MINI-MELF  
.020(0.5)  
.012(0.3)  
.020(0.5)  
.012(0.3)  
• Terminals: Solderable per MIL-STD-202E, Method 208  
• Polarity: See Diagram Below  
.146(3.7)  
.130(3.3)  
• Approx. Weight: 0.03 grams  
• Mounting Position: Any  
Packing information  
T/R - 2.5K per 7" plastic Reel  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Parameter  
Power Dissipation at Tamb = 25 OC  
Symbol  
Value  
500  
Units  
mW  
P
TOT  
Junction Temperature  
175  
OC  
OC  
T
J
Storage Temperature Range  
-65 to +175  
TS  
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Thermal Resistance Junction to Ambient Air  
--  
0.3  
1
K/mW  
RthA  
--  
Forward Voltage at IF = 100mA  
--  
V
VF  
--  
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.  
PAGE . 1  

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