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GL5JV302B0SE PDF预览

GL5JV302B0SE

更新时间： 2024-11-24 20:26:55
品牌 Logo 应用领域
夏普 - SHARP 光电
页数 文件大小 规格书
15页 302K
描述
Single Color LED, Amber, Colorless Transparent, T-1 3/4, 5mm,

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GL5JV302B0SE 技术参数

生命周期：ObsoleteReach Compliance Code：unknown
风险等级：5.84Is Samacsys：N
颜色：AMBER配置：SINGLE
最大正向电流：0.03 A透镜类型：COLORLESS TRANSPARENT
标称发光强度：640.0 mcd安装特点：RADIAL MOUNT
功能数量：1端子数量：2
最高工作温度：85 °C最低工作温度：-40 °C
光电设备类型：SINGLE COLOR LED总高度：8 mm
包装方法：BULK峰值波长：591 nm
形状：ROUND尺寸：5 mm
表面贴装：NOT代码：T-1 3/4
端子节距：2.54 mm视角：30 deg
Base Number Matches：1

GL5JV302B0SE 数据手册

 浏览型号GL5JV302B0SE的Datasheet PDF文件第2页浏览型号GL5JV302B0SE的Datasheet PDF文件第3页浏览型号GL5JV302B0SE的Datasheet PDF文件第4页浏览型号GL5JV302B0SE的Datasheet PDF文件第5页浏览型号GL5JV302B0SE的Datasheet PDF文件第6页浏览型号GL5JV302B0SE的Datasheet PDF文件第7页 
General Description of Light Emitting Diodes  
(3) Installation using a holder  
I Handling Precautions  
During an LED lamp positioning, in case of using a holder, holder A  
should be designed to be smaller than the inside dimension of lead  
pins. Holder B should be designed to be larger than the outside  
dimension of lead pins.  
This product is sensitive to static electricity and demands a lot of  
attention. Please take all possible measures for static electricity and  
surge solution.  
(Notes)¡Pay attention to the thermal  
I Lead Forming Method  
expansion coefficient of the  
material used for the holder.  
Since the holder expands and  
Avoid forming a lead pin with the lead pin base as a fulcrum: be  
sure to hold a lead pin firmly when forming.  
Lead pins should be formed before soldering.  
Holder  
A
contracts due to preheat and  
soldering heat, mechanical  
B
stress may be applied to the lead  
pins, resulting in disconnection.  
Hold a lead pin firmly when forming  
(4) Installation to the case  
Do not fix part A with adhesives  
A
when fixed to the case as shown in  
the figure.  
A hole of the case should be  
Case  
I Installation  
(1) Installation on a PWB  
When mounting an LED lamp on a PWB, do not apply physical  
stress to the lead pins.  
designed not to be smaller than the  
outside diameter of LED lamp resin.  
I Soldering Conditions  
Solder the lead pins under the following conditions. (1.6mm or  
more from the resin package)  
(Notes)¡The lead pin pitch should match the PWB pin-hole pitch:  
do not broaden out or narrow down the lead pins.  
¡When positioning an LED lamp, basically employ an  
LED with tie-bar cut or use a spacer.  
Type of Soldering  
1. Manual soldering  
2. Wave soldering  
Conditions  
295˚C ± 5˚C, within 3 seconds  
260˚C ± 5˚C, within 5 seconds  
Preheating 70˚C to 80˚C, within 30 seconds  
Soldering 245˚C ± 5˚C, within 5 seconds  
3. Reflow soldering  
(Notes)¡Avoid dipping resin into soldering bath.  
¡Avoid applying stress to lead pins while they are heated.  
For example, when the LED lamp is moved with the heat  
applied to the lead pins during manual soldering or solder  
repair, disconnection may occur.  
Not acceptable  
PWB  
Acceptable  
I Cleaning  
Conditions described below shall be observed in cleaning.  
(1) Solvent cleaning : Solvent temperature 45˚C or less, for 3 min.  
(2) Ultrasonic cleaning : The affect on the device is different  
depending on the size of the cleaning bath, ultrasonic output, board  
size, and device mounting method. Test the cleaning method under  
actual conditions and check the abnormalities before actual use.  
(3) Recommended solvents are shown below.  
(2) When an LED lamp is mounted directly on a PWB  
If the bottom face of an LED lamp is mounted directly on single-  
sided PWB (1.6mm t or more), the base of the lead pins may be  
subjected to have physical stress due to PWB warp, cutting or  
clinching of lead pins. Prior to use, be sure to check that no  
disconnection inside of the resin or  
Melthyl alcohol, Ethyl alcohol, Isopropyl alcohol.  
When other solvents are used, package resin may be penetrated by  
solvents. Please confirm under actual conditions before use.  
damage to resin etc., is found.  
When an LED lamp is mounted on a  
double-sided PWB, the heat during  
soldering affects the resin; therefore,  
keep the LED lamp more than 1.6mm  
afloat above the soldering position.  
1.6A  
Notice  
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in  
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
Internet address for Electronic Components Group http://sharp-world.com/ecg/  
2
Internet  
1234567...15

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