GBJ15005
THRU
M C C
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20736 Marilla Street Chatsworth
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TM
Micro Commercial Components
GBJ1510
Features
15 Amp
Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix
designates RoHS Compliant. See ordering information)
Glass Passivated
Bridge Rectifier
50 to 1000 Volts
Ideal for printed circuit board
Low forward voltage drop, high current capability.
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
GBJ
Maximum Ratings
I
•
•
•
•
•
•
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
A
H
Typical Thermal Resistance 0.8°C/W J to C (With heatsink)
Typical Thermal Resistance 3.5°C/W J to L (Without heatsink)
Typical Thermal Resistance 12°C/W J to A (Without heatsink)
UL Recognized File # E165989
G
B
D
MCC
Catalog
Number
Device
Marking
Maximum
Reccurrent
Peak Reverse
Voltage
50V
Maximum Maximum
RMS
Voltage
E
K
+
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
F
P
C
GBJ15005 GBJ15005
35V
70V
L
GBJ1501
GBJ1502
GBJ1504
GBJ1506
GBJ1508
GBJ1510
GBJ1501
GBJ1502
GBJ1504
GBJ1506
GBJ1508
GBJ1510
100V
200V
400V
600V
800V
1000V
140V
280V
420V
560V
700V
M
J
N
O
O
DIMENSIONS
INCHES
MM
DIM
A
B
C
D
E
F
G
H
MIN
1.170
.780
.670
.019
.430
.090
.120
.130
MAX
1.190
.800
.710
.019
.440
.110
.130
.150
MIN
29.70
19.70
17.00
4.70
10.80
2.30
3.10
3.40
MAX
NOTE
30.30
20.30
18.00
4.90
11.20
2.70
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
IF(AV)
15 A
Tc = 100°C
Peak Forward Surge
Current
IFSM
240A
8.3ms, half sine
3.40
3.80
Maximum
I
J
.170
.100
.020
.080
.040
.390
.190
.110
.030
.090
.040
.400
4.40
2.50
0.60
2.00
0.90
9.80
4.80
2.90
0.80
2.40
1.10
10.20
7.70
4.20
IFM = 7.5A
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
VF
IR
1.05V
K
L
M
N
O
P
TJ = 25°C
.290
.150
.300
.170
7.30
3.80
10 µA TJ = 25°C
500uA
TJ = 125°C
I2t Rating for fusing
I2t
240A2S
60 pF
(t<8.3ms)
Typical Junction
Capacitance
CJ
Measured at
1.0MHz, VR=4.0V
~
~
Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7
Case Type
3. Device mounted on 300mm * 300mm *1.6mm Cu Plate Heatsink
www.mccsemi.com
Revision: 6
2008/01/30
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