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G6Z-K-1FEAR-DC4.5

更新时间： 2023-05-15 00:00:00
品牌 Logo 应用领域
欧姆龙 - OMRON 光电二极管
页数 文件大小 规格书
19页 965K
描述
RF Relay, SPDT, Latched, 0.08A (Coil), 4.5VDC (Coil), 360mW (Coil), 0.5A (Contact), 30VDC (Contact), 2600MHz, 10W (RF Input), DC Input, AC/DC Output, Surface Mount-Straight

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G6Z-K-1FEAR-DC4.5 数据手册

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Safety Precautions  
Substrate for High-frequency Characteristic  
Compensation (75-Ω Models, E-shape or Y-shape)  
■ Precautions for Correct Use  
Please observe the following precautions to prevent failure to oper-  
ate, malfunction, or undesirable effect on product performance.  
30.7  
(Unit: mm)  
20  
4-dia. through-hole  
High-frequency Characteristics  
Measurement Method and  
Measurement Substrate  
0.6-dia. through-hole  
1
0.95  
High-frequency characteristics for the G6Z are measured in the way  
shown below. Consult your OMRON representative for details on 50-  
Ω models.  
40 30  
Measurement Method for 75-ΩModels  
G6Z  
Network vector analyzer  
(Agilent Technologies)  
75-Ω terminating  
resistance  
Substrate Types  
Material: FR-4 glass epoxy (glass cloth impregnated with epoxy  
resin and copper laminated to its outer surface)  
HP8753D  
50Ω/75Ω adapter  
(Agilent Technologies)  
11852B-004  
Thickness: 1.6 mm  
Thickness of copper plating:18 µm  
Note: 1. The compensation substrate is used when measuring the  
Relay’s insertion loss. The insertion loss is obtained by  
subtracting the measured value for the compensation sub-  
strate from the measured value with the Relay mounted to  
the high-frequency measurement substrate.  
Through-hole Substrate (75-Ω Models, E-shape or  
Y-shape)  
40  
30  
4-dia. through-hole  
2. For convenience, the diagrams of the high-frequency  
measurement substrates given here apply both to models  
with an E-shape terminal structure and to models with a Y-  
shape terminal structure.  
0.4  
(Unit: mm)  
1.4  
3. Be sure to mount a standoff tightly to the through-hole sub-  
strate.  
3.59  
4. Use measuring devices, connectors, and substrates that  
are appropriate for 50 Ω and 75 Ω respectively.  
40 30  
1
5. Ensure that there is no pattern under the Relay. Other-  
wise, the impedance may be adversely affected and the  
Relay may not be able to attain its full characteristics.  
0.95  
6.3  
Handling  
0.6-dia. through-hole  
Do not use the Relay if it has been dropped. Dropping the Relay may  
adversely affect its functionality.  
SMD-type Substrate (75-ΩModels, E-shape or Y-shape)  
Protect the Relay from direct sunlight and keep the Relay under nor-  
mal temperature, humidity, and pressure.  
40  
Flow Soldering  
30  
4-dia. through-hole  
1.4  
(Unit: mm)  
Solder: JIS Z3282, H63A  
0.4  
Soldering temperature: Approx. 250°C (260°C if the DWS method is  
used)  
0.6-dia. through-hole  
Soldering time: Approx. 5 s max. (approx. 2 s for the first time and  
approx. 3 s for the second time if the DWS method is used)  
Be sure to make a molten solder level adjustment so that the solder  
will not overflow on the PCB.  
40 30  
3.91  
1
0.95  
6.3  
16  
High-frequency Relay G6Z  
1...13141516171819

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