3. Board to board type
4. Board to cable type
q Flux swell prevention
q Complete lock with easy operation
The straight dip type takes the complete flux tight action
from the board back side at solder dipping. The type is
prepared, corresponding to whether or not cleaning is
required.
Employing the inner lock system, complete lock and eject
actions can be performed with easy operation.
w Applicable cable
The applicable cable is the <UL2651>AWG#28 flat cable
(7/0.127mm), and the jacket size is 0.9 0.1mm.
w Stack height 12mm~16mm
The board stack height can be set to every 1 mm unit up
to 12~16mm.
5. SMT type
q Strength security with metaltab
e Mis-insertion preventive mechanism
The right angle type is equipped with metaltab to secure
soldering strength, and constructed so as to fix by
screws. The straight type can choose whether or not
metaltab are required.
The mating area is designed in a mechanism so as to
prevent mis-insertion, and complete countermeasures
have been taken against wrenching.
ꢀApplications
Computers, peripheral equipments, various machines etc.
ꢀProduct Specifications
Rated Current 0.5A
Operating Temperature Range -55ç~+85ç (Note 1) Storage Temperature Range -10ç~+60ç (Note 2)
Rating
Rated Voltage 125A AC Operating Humidity Range 40~80%
Storage Humidity Range 40 ~ 70% (Note 2)
Item
Specification
Condition
1. Insulation Resistance 1000Mø min
Measured at 250V DC
2. Withstand Voltage
3. Contact Resistance
4. Vibration
Neither short nor breakdown
AC for 1 minute
45mø max.
Measured at 100mA
Electrical discontinuity, 1µS max.
0~55Hz, single amplitude 0.75mm in 3 directions for 2 hours, respectively
5. Moisture Resistance
Contact resistance: 55mø max. Insulation resistance: 100Mø min. Temperature 40 2ç, humidity 90~95%, duration 96 hours
Contact resistance: 55mø max.
(-55ç: 30 minutesꢀ15~35ç: 2~3 minutes ꢀ
6. Temperature Cycle
7. Operation Life
Insulation resistance: 100Mø min.
(-85ç: 30 minutesꢀ15~35ç: 2~3 minutes) 5 cycles
Crack, break, and loosen not found on the parts.
Contact resistance: 55 mø max.
500 cycles
SMT type Reflow: Recommended temperature profile
DIP type Soldering iron temperature: 260ç for 10 seconds
8. Resistance to soldering heat No resin area fusion to degrade performance
Note 1. Temperature rise included when energized.
Note 2. This storage indicates a long-term storage state for the unused product before the board mounted.
The operating temperature range is applied to the non-energized state after the board mounted and the temporary storage
state for transportation.
Note 3. The above standard represents this series. Individual formal agreement should be based on the "Specification".
ꢀMaterial
Parts
Material
Polyamid
PBT/Polyamid
PPS
Finish
Black
Remark
Insulator
Dip type
Socket
SMT type
Receptacle
Socket
UL94V-0
Light brown
Contact
Phosphor bronze
________
Selective gold plating
Header
Phosphor bronze or brass
ꢀStacking Variation
Unit:mm
SMT type
Dip type
Receptacle
FX2C-πS-1.27DSA(L)
FX2C2-πS-1.27DSA(L)
FX2-πS-1.27SV(L)
Header
FX2CA-πS-1.27DSA(L) FX2CA2-πS-1.27DSA(L)
FX2C-πP-1.27DSA(L)
12.0
14.0
12.2
FX2CA-πP-1.27DSA(L)
FX2CA1-πP-1.27DSA(L)
FX2CA2-πP-1.27DSA(L)
FX2-πP-1.27SV(L)
Dip type
13.0
14.0
12.1
15.0
16.0
14.1
13.2
14.2
12.3
SMT type
A143