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FX11LA-80P8-SV22 PDF预览

FX11LA-80P8-SV22

更新时间: 2024-11-19 02:26:11
品牌 Logo 应用领域
广濑 - HRS /
页数 文件大小 规格书
8页 545K
描述
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections

FX11LA-80P8-SV22 数据手册

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NEW  
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections  
FX11L Series  
Cross-Section of Mating  
Features  
1. Low Profile Design  
The board to board mating height of 2 mm suits smaller,thinner  
case designs.  
2. Improved Transmission Efficiency Between  
Boards  
Transmission characteristics have been improved through  
a design that fixes ground plates to both sides of the  
header and receptacle.  
3. 10 Signal:1 Ground Arrangement  
Signal and ground are arranged in a ratio of 10:1 with the  
ground plate SMT connected to the board. The ground  
stability achieved serves to reduce noise.  
4. Reinforced Fittings for Added Solder Weld  
Strength  
Reinforced fittings provide greater adhesion to the  
board,protecting against peeling.The unique connector  
design provides a connection between the fitting and the  
ground plate for a stronger ground.  
Detailed Figure of Solder Gap  
5. Suited to High-Density Applications  
The signal contact pitch of 0.5mm produces a smaller  
connector utilizing less board area for mounting.  
6. Structure Prevents Solder Wicking  
A solder gap has been designed into the contact SMT  
portion to prevent solder wicking.  
7. Optional Ground Plate  
An alternate style without the ground plate is available.The  
space provided by the ground plate removal has been filled  
with additional signal contacts.  
Note: The thickness of the solder paste is not included in the 2 mm board-to-board stack height.  
Applications  
Notebook computers, PDA, and other miniature electronic equipment.  
2003.7  
1

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