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FX11LA-100S/10-SV(21) PDF预览

FX11LA-100S/10-SV(21)

更新时间： 2024-11-19 07:23:07
品牌 Logo 应用领域
广濑 - HRS PC连接器
页数 文件大小 规格书
8页 574K
描述
Board Stacking Connector, 110 Contact(s), 2 Row(s), Female, Straight, 0.02 inch Pitch, Surface Mount Terminal, Beige Insulator, Receptacle

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FX11LA-100S/10-SV(21) 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8536.69.40.40风险等级：5.88
其他特性：HIGH DENSITY, LOW PROFILE, 10 GROUND CONTACTS ALSO AVAILABLE板上安装选件：POLARIZATION POST
主体宽度：0.244 inch主体深度：0.065 inch
主体长度：1.457 inch主体/外壳类型：RECEPTACLE
连接器类型：BOARD STACKING CONNECTOR联系完成配合：NOT SPECIFIED
联系完成终止：GOLD FLASH触点性别：FEMALE
触点材料：COPPER ALLOY触点模式：RECTANGULAR
触点电阻：60 m Ω触点样式：BELLOWED TYPE
DIN 符合性：NO介电耐压：150VAC V
耐用性：50 Cycles滤波功能：NO
IEC 符合性：NO绝缘电阻：100000000 Ω
绝缘体颜色：BEIGE绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码：e4MIL 符合性：NO
插接触点节距：0.02 inch插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：2装载的行数：2
最高工作温度：85 °C最低工作温度：-55 °C
选件：GENERAL PURPOSEPCB接触模式：RECTANGULAR
PCB触点行间距：5.6896 mm电镀厚度：4u inch
极化密钥：POLARIZED HOUSING额定电流（信号）：0.3 A
参考标准：UL可靠性：COMMERCIAL
子类别：Headers and Edge Type Connectors端子长度：
端子节距：0.5 mm端接类型：SURFACE MOUNT
触点总数：110UL 易燃性代码：94V-0

FX11LA-100S/10-SV(21) 数据手册

 浏览型号FX11LA-100S/10-SV(21)的Datasheet PDF文件第2页浏览型号FX11LA-100S/10-SV(21)的Datasheet PDF文件第3页浏览型号FX11LA-100S/10-SV(21)的Datasheet PDF文件第4页浏览型号FX11LA-100S/10-SV(21)的Datasheet PDF文件第5页浏览型号FX11LA-100S/10-SV(21)的Datasheet PDF文件第6页浏览型号FX11LA-100S/10-SV(21)的Datasheet PDF文件第7页 
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
NEW  
0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections  
FX11L Series  
■Cross-Section of Mating  
■Features  
1. Low Profile Design  
The board to board mating height of 2 mm suits smaller,thinner  
case designs.  
2. Improved Transmission Efficiency Between  
Boards  
Transmission characteristics have been improved through  
a design that fixes ground plates to both sides of the  
header and receptacle.  
3. 10 Signal:1 Ground Arrangement  
Signal and ground are arranged in a ratio of 10:1 with the  
ground plate SMT connected to the board. The ground  
stability achieved serves to reduce noise.  
4. Reinforced Fittings for Added Solder Weld  
Strength  
Reinforced fittings provide greater adhesion to the  
board,protecting against peeling.The unique connector  
design provides a connection between the fitting and the  
ground plate for a stronger ground.  
Detailed Figure of Solder Gap  
5. Suited to High-Density Applications  
The signal contact pitch of 0.5mm produces a smaller  
connector utilizing less board area for mounting.  
6. Structure Prevents Solder Wicking  
A solder gap has been designed into the contact SMT  
portion to prevent solder wicking.  
7. Optional Ground Plate  
An alternate style without the ground plate is available.The  
space provided by the ground plate removal has been filled  
with additional signal contacts.  
Note: The thickness of the solder paste is not included in the 2 mm board-to-board stack height.  
■Applications  
Notebook computers, PDA, and other miniature electronic equipment.  
2003.7  
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