Datasheet > FX10B-10-SV

FX10B-10-SV

更新时间： 2024-11-17 12:02:59

品牌	Logo	应用领域
广濑 - HRS		连接器
页数	文件大小	规格书
20页	637K
描述
10Gbps 0.5mm pitch Stacking Connectors

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

FX10B-10-SV 数据手册

10⁺Gbps 0.5mm pitch Stacking Connectors

FX10 Series Electrical Interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH)

●Mechanical Features

● 0.5mm Pitch

● Stacking Height : 4 ~ 8mm

● Number of Contacts

With ground plate type : 80 / 100 / 120 / 140

Without ground plate type : 96 / 120 / 144 / 168

● Improved Transmission Efficiency

Between Boards

Transmission characteristics have been improved through a

design that fixes ground plates to both sides of the header

and receptacle.

●With GND Plate Type

● 10 Signal:1 Ground Arrangement

Signal and ground are arranged in a ratio of 10:1 with the

ground plate SMT connected to the board. The ground

stability achieved serves to reduce noise.

Ground

plate

● Metal Fittings for Added Solder Weld

Signal contact

Strength

Metal fittings provide greater adhesion to the board,

protecting against peeling. The unique connector design

provides a connection between the fitting and the ground

plate for a stronger ground.

Housing

Metal fitting

Ground plate and metal

fitting make contact

● Suited to High-Density Applications

The signal contact pitch of 0.5 mm produces a smaller

connector utilizing less board area for mounting.

●Cut Section

● High contact reliability

Effective mating length is 1.1 mm for signal contacts.

● Optional Ground Plate

An alternate style without the ground plate is available. The

space provided by the ground plate removal has been filled

with additional signal contacts.

●Signal Integrity Features

115

110

105

100

●Insertion-Loss-to-Crosstalk-Ratio(ICR)

The insertion-loss-to-crosstalk-ratio (ICR) with five-

aggressor differential FEXT meets the extrapolated

IEEE 802.3ap specification for 10 Gbps.

●Differential Impedance

The differential impedance is within 100 +/- 10 ohms

at 30ps rise time (20% to 80%).

ICR

ICR spec

S(3,3)

800 1000

200

400

Time (ps)

600

Frequency (GHz)

●Stack Height

●With ground plate

Headers

FX10#-*P/*-SV FX10#–*P/*–SV1

Receptacles

FX10#-*S/*-SV

4mm

5mm

●Without ground plate

Headers

FX10#-*P-SV FX10–*P–SV1 FX10#-168P-SV2 FX10#-168P-SV3 FX10#-168P-SV4

Receptacles

(H):Reference dimension

4mm

5mm

6mm

7mm

8mm

FX10#-*S-SV

2011.01w

12 3 4 5 6 7...20

中文翻译

下载PDF

与FX10B-10-SV相关器件

型号	品牌	获取价格	描述	数据表
FX10B120/12-P-SV1	HRS	获取价格	0.5mm Pitch Connectors with Ground Plate for Board-to-Board Connections
FX10B120/12-P-SV121	HRS	获取价格	0.5mm Pitch Connectors with Ground Plate for Board-to-Board Connections
FX10B120/12-S-SV1	HRS	获取价格	0.5mm Pitch Connectors with Ground Plate for Board-to-Board Connections
FX10B120/12-S-SV121	HRS	获取价格	0.5mm Pitch Connectors with Ground Plate for Board-to-Board Connections
FX10B-120P	HRS	获取价格	10Gbps 0.5mm pitch Stacking Connectors
FX10B-120P/12-SV(71)	HRS	获取价格	连接器类型:插头;开口间距:0.5 mm;安装间距:0.5 mm;嵌合高度(Min.):4
FX10B-120P/12-SV(91)	HRS	获取价格	连接器类型:插头;开口间距:0.5 mm;安装间距:0.5 mm;嵌合高度(Min.):4
FX10B-120P/12-SV(92)	HRS	获取价格	Board Stacking Connector
FX10B-120P/12-SV1(71)	HRS	获取价格	连接器类型:插头;开口间距:0.5 mm;安装间距:0.5 mm;嵌合高度(Min.):5
FX10B-120P/12-SV1(82)	HRS	获取价格	Board Connector, 120 Contact(s), 2 Row(s), Male, Straight, 0.02 inch Pitch, Surface Mount

与FX10B-10-SV相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

17
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

12
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

42
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

35

产品中心

服务支持

精选活动

关于我们

帮助中心

FX10B-10-SV

FX10B-10-SV 数据手册

与FX10B-10-SV相关器件

与FX10B-10-SV相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

FX10B-10-SV

FX10B-10-SV 数据手册

与FX10B-10-SV相关器件

与FX10B-10-SV相关文章

您还可以找

您在本页遇到什么问题？