NOTES:
FTSH-1XX-XX-XXX-DV-XXX-XXX
C
REVISION FH
1.
REPRESENTS A CRITICAL DIMENSION.
OPTIONS
2. PARTS MAY BE CUT TO POSITION.
No OF POSITIONS
-02 THRU -50
(PER ROW)
-P: PICK & PLACE PAD (4 POS MIN)
3. MAXIMUM CUT FLASH: .015[0.38],
(SEE FIG 11, SHT 4 & TABLE 5)
LOOSE FLASH MUST BE REMOVED.
-TR: TAPE & REEL PACKAGING
4. MINIMUM PUSHOUT FORCE: 1.0 LB.
DO NOT
SCALE FROM
THIS PRINT
-ES: END SHROUDS (SEE FIG 6, SHT 3)
5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.
6. TUBE ONLY -04 THROUGH -50 POSITIONS (SEE TABLE 2).
7. SHEAR TAILS TO DIMENSION SHOWN.
LEAD STYLE
(MOLDED IN 5 POS MIN; -02 & -03 LEAD STYLE ONLY)
(SNAP SHROUDS 9 POS MIN; -02 & -03 LEAD STYLE ONLY)
-EJ: EJECTOR SHROUDS: SEE FIG 4, SHT 2)
-01: .120 [3.05]
-02: .075 [1.91]
8. MAXIMUM BURR ALLOWANCE: .003 [0.08]
-03: .065 [1.65]
(10 POS MIN; -01 LEAD STYLE ONLY)
9. GOLD PLATING TO BE ON POST, TIN PLATING TO BE ON TAIL.
10. FILL WITH ALIGNMENT PIN HOLES TO TAIL SIDE.
11. DUE TO THE HIGH AMOUNT OF INSERTION FORCE NEEDED, LOCKING CLIPS
ARE NOT COMPATIBLE WITH AUTO PLACEMENT. SAMTEC RECOMMENDS
MANUAL PLACEMENT FOR ALL ASSEMBLIES WITH LOCKING CLIPS.
12. VOIDS MAY OR MAY NOT BE PRESENT ON POSITIONS 5 THRU 8 AND CAN
BE MIXED WITHIN AN ORDER.
-04: .150 [3.81]
-EJM: EJECTOR SHROUDS WITH MOLDED ALIGNMENT PIN
(SEE FIG 5, SHT 2; 10 POS MIN; -01 LEAD STYLE ONLY)
(NOT VALID WITH -A OPTION)
-EJC: EJECTOR SHROUDS WITH LOCKING CLIP
(SEE FIG 5, SHT 2 & NOTE 11)
(10 POS MIN; -01 LEAD STYLE ONLY; NOT VALID WITH -A OPTION)
-EC: LOCKING CLIP (SEE FIG 7, SHT 3 & NOTE 11)
(9 POS MIN; -02 & -03 LEAD STYLE ONLY)
-EP: GUIDE POST (SEE FIG 8, SHT 3; 9 POS MIN; -02 & -03 LEAD STYLE
ONLY)(USE ONLY WHEN MATING WITH CLP)
-EL: BOARD LOCK (SEE FIG 9, SHT 3)
-05 .170 [4.32]
-14: .150 [3.81](NOT AVAILABLE
WITH -SM, FM, LM PLATING
OPTIONS)
PLATING SPECIFICATION
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
13. ON LEAD STYLES -02 THROUGH -03 THE T-1S15-18-XXX CAN
BE SUBSTITUTED FOR T-1S15-16-XXX.
14. ON LEAD STYLES -01 AND -04, T-1S15-17 CAN BE
SUBSTITUTED FOR T-1S15-15-XXX.
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
15. NO TIN PLATING ALLOWED ON THE POST FOR
LEAD STYLES -01, -02, -03 & -04 IN COMBINATION WITH THE
T-1S15-XX-XXX TERMINAL.
(9 POS MIN; -02 & -03 LEAD STYLE ONLY)
(USE ONLY WHEN MATING WITH CLP)
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-EPC: GUIDE POST & LOCKING CLIP
16. MAXIMUM HEIGHT VARIATION .005[0.13] BETWEEN ROWS.
(SEE FIG 10, SHT 3 & NOTE 11; USE ONLY WHEN MATING WITH CLP)
(9 POS MIN; -02 & -03 LEAD STYLE ONLY; NOT VALID
WITH -A OPTION)
-H: 30µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
C
-LM: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
+0.13
No OF POS x .0500+.005
[
]
-A: ALIGNMENT PIN (MOLDED OR STAKED; SEE FIG 3, SHT 2)
(MOLDED: 3 POS MIN; STAKED: 6 POS MIN)
(SAMTEC DISCRETION ON WHICH -A PIN USED)
-K: KEYING OPTION FOR MATING WITH FFSD
(SEE TABLE 3, SHT 2; 05 THRU 25 AVAILABLE AS STANDARD)
(POSITION 13, 17, 20 & 25 AVAILABLE WITH -EXX OPTION)
(LEAD STYLE -01 ONLY, SEE FIG 2, SHT 2 & NOTE 12)
(ALIGNMENT PIN AVAILABLE WITH -K OPTION BUT MUST BE MOLDED)
(MUST USE FTSH-50-CN-XX-X OR FTSHC-50-CN-XX-X)
-M: METAL PICK & PLACE PAD (5 POS MIN; USE MPP-22-5)
(SEE FIG 12, SHT 4; NOT AVAILABLE WITH -K OPTION)
-.010 -0.25
-FM: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
(No OF POS x .0500[1.27]) - .050[1.27]
02
50
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-LTL: 10µ" SELECTIVE GOLD IN CONTACT AREA,
TIN/LEAD (90/10+/-5%) TAIL
-G: 10µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
.135 3.43
REF
*
TAIL OPTION
-DV: DOUBLE VERTICAL
POLARIZING OPTION
XXX INDICATES POSITION TO BE OMITTED
(NOT AVAILABLE WITH EXX OPTIONS)
(ONLY AVAILABLE WITH -F, -FM, -L, -LM PLATING OPTIONS)
49
01
FTSH-50-D
2
MAX SWAY
(EITHER DIRECTION)
* = NOT ENGINEERING APPROVED
C
.016 0.41 SQ
REF (TYP)
2
MAX SWAY
.050±.008 1.27±0.20
(EITHER DIRECTION)
SEE TABLE 1
2
MAX SWAY
(EITHER DIRECTION)
C
"B"
C
90°±3°
"A"
CONTACT AREA
(SEE NOTE 9 & TABLE 1)
(SEE NOTE 16)
+.005
-.003
+0.13
2.92
-0.08
.099 2.51
REF
.115
(SEE NOTE 5)
SEE NOTE 3
(2 PLCS)
.004[.10]
PATENT NUMBERS
.23 5.8
(SEE NOTE 7)
.230 5.84 REF
FIG 1
5713755 / 5961339
SEE NOTE 8
FTSH-1XX-XX-XXX-DV SHOWN
HAND FILL USING T-1S40
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
*
*
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
TOLERANCES ARE:
DECIMALS
ANGLES
1
.XX: .01 [.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
.XXX: .005 [.13]
PHONE: 812-944-6733
e-Mail info@SAMTEC.com
DESCRIPTION:
FAX: 812-948-5047
.XXXX: .0010 [.025]
code 55322
SHEET SCALE: 5:1
MATERIAL:
DO NOT SCALE DRAWING
.050 x .050 CL DOUBLE VERTICAL SMT TERMINAL STRIP
INSULATOR: LCP UL 94 VO
TERMINAL: PHOSPHOR BRONZE
DWG. NO.
FTSH-1XX-XX-XXX-DV-XXX-XXX
* = SEE NOTE 13
*** = SEE NOTE 14
10/12/1995 SHEET 1 OF
BY: PURVIS
5
F:\DWG\MISC\MKTG\FTSH-1XX-XX-XXX-DV-XXX-XXX-MKT.SLDDRW
5秒后页面跳转
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
