NOTES:
FTSH-1XX-XX-XXX-DV-XXX
REVISION ET
C
1.
REPRESENTS A CRITICAL DIMENSION.
OPTIONS
No OF POSITIONS
-02 THRU -50
2. PARTS MAY BE CUT TO POSITION.
-P: PICK & PLACE PAD (4 POS MIN)
3. MAXIMUM CUT FLASH: .015[0.38],
(SEE FIG 11, SHT 4 & TABLE 5)
(PER ROW)
LOOSE FLASH MUST BE REMOVED.
-TR: TAPE & REEL PACKAGING
4. MINIMUM PUSHOUT FORCE: 1.0 LB.
-ES: END SHROUDS (SEE FIG 6, SHT 3)
LEAD STYLE
5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.
6. TUBE ONLY -04 THROUGH -50 POSITIONS (SEE TABLE 2).
7. SHEAR TAILS TO DIMENSION SHOWN.
(MOLDED IN 5 POS MIN; -02 & -03 LEAD STYLE ONLY)
(SNAP SHROUDS 9 POS MIN; -02 & -03 LEAD STYLE ONLY)
(MUST USE FTSH-50-D)
-01: .120 [3.05]
-02: .075 [1.91]
-03: .065 [1.65]
-04: .150 [3.81]
-05 .170 [4.32]
-14: .150 [3.81]
DO NOT
SCALE FROM
THIS PRINT
8. MAXIMUM BURR ALLOWANCE: .003 [0.08]
-EJ: EJECTOR SHROUDS: SEE FIG 4, SHT 2)
(10 POS MIN; -01 LEAD STYLE ONLY)(MUST USE FTSH-50-D)
-EJM: EJECTOR SHROUDS WITH MOLDED ALIGNMENT PIN
(SEE FIG 5, SHT 2; 10 POS MIN; -01 LEAD STYLE ONLY)
(NOT VALID WITH -A OPTION)(MUST USE FTSH-50-D)
-EJC: EJECTOR SHROUDS WITH LOCKING CLIP
(SEE FIG 5, SHT 2 & NOTE 11)
9. GOLD PLATING TO BE ON POST, TIN PLATING TO BE ON TAIL.
10. FILL WITH ALIGNMENT PIN HOLES TO TAIL SIDE.
11. DUE TO THE HIGH AMOUNT OF INSERTION FORCE NEEDED, LOCKING CLIPS
ARE NOT COMPATIBLE WITH AUTO PLACEMENT. SAMTEC RECOMMENDS
MANUAL PLACEMENT FOR ALL ASSEMBLIES WITH LOCKING CLIPS.
12. VOIDS MAY OR MAY NOT BE PRESENT ON POSITIONS 5 THRU 8 AND CAN
BE MIXED WITHIN AN ORDER.
(NOT AVAILABLE WITH
-SM, FM, LM PLATING OPTIONS)
PLATING SPECIFICATION
(10 POS MIN; -01 LEAD STYLE ONLY; NOT VALID WITH -A
OPTION)
(MUST USE FTSH-50-D)
13. ON LEAD STYLES -01 THROUGH -04 THE T-1S15-03 CAN
BE SUBSTITUTED FOR T-1S15-14.
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
C
-EC: LOCKING CLIP (SEE FIG 7, SHT 3 & NOTE 11)
(9 POS MIN; -02 & -03 LEAD STYLE ONLY)(MUST USE FTSH-50-D)
-EP: GUIDE POST (SEE FIG 8, SHT 3; 9 POS MIN; -02 & -03 LEAD STYLE
ONLY)
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
+.005 +0.13
No OF POS x .0500
[
]
-.010 -0.25
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
(USE ONLY WHEN MATING WITH CLP)(MUST USE FTSH-50-D)
-EL: BOARD LOCK (SEE FIG 9, SHT 3)
(No OF POS x .0500[1.27]) - .050[1.27]
-H: 30µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
(9 POS MIN; -02 & -03 LEAD STYLE ONLY)
02
-LM: 10µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
50
(USE ONLY WHEN MATING WITH CLP)(MUST USE FTSH-50-D)
-EPC: GUIDE POST & LOCKING CLIP
(SEE FIG 10, SHT 3 & NOTE 11; USE ONLY WHEN MATING WITH CLP)
(9 POS MIN; -02 & -03 LEAD STYLE ONLY; NOT VALID
WITH -A OPTION)(MUST USE FTSH-50-D)
-FM: 3µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
.135 3.43
REF
-A: ALIGNMENT PIN (MOLDED OR STAKED; SEE FIG 3, SHT 2)
(MOLDED: 3 POS MIN; STAKED: 6 POS MIN)
(SAMTEC DISCRETION ON WHICH -A PIN USED)
(MUST USE FTSH-50-D)
-LTL: 10µ" SELECTIVE GOLD IN CONTACT AREA,
TIN/LEAD (90/10+/-5%) TAIL
-G: 10µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
-K: KEYING OPTION FOR MATING WITH FFSD
(SEE TABLE 3, SHT 2; 05 THRU 25 AVAILABLE AS STANDARD)
(POSITION 13, 17, 20 & 25 AVAILABLE WITH -EJ OPTION)
(LEAD STYLE -01 ONLY, SEE FIG 2, SHT 2 & NOTE 12)
(ALIGNMENT PIN AVAILABLE WITH -K OPTION BUT MUST BE MOLDED)
(MUST USE FTSH-XX-CN-XX)
49
01
TAIL OPTION
-DV: DOUBLE VERTICAL
FTSHC-50-D
2
MAX SWAY
(USE **FTSHC-1XX-XX-XXX-DV FOR ALL OPTIONS
EXCEPT -ES, -EJ, -EJM, -EJC, -EC, -EP, -EL, -EPC, -A,
THEN USE FTSH-50-D AND BUILD PER PRINT)
(EITHER DIRECTION)
-M: METAL PICK & PLACE PAD (5 POS MIN; USE MPP-22-5)
(SEE FIG 12, SHT 4; NOT AVAILABLE WITH -K OPTION)
*
** = SEE FTSHC-1XX-XX-XXX-DX-XX PRINT FOR DETAILS
* = NOT ENGINEERING APPROVED
2
MAX SWAY
C
(EITHER DIRECTION)
.016 0.41 SQ
REF (TYP)
2
MAX SWAY
.050±.008 1.27±0.20
(EITHER DIRECTION)
SEE TABLE 1
C
"B"
90°±3°
CONTACT AREA
(SEE NOTE 9 & TABLE 1)
"A"
C
+.005
-.003
+0.13
.099 2.51
REF
.115
2.92
-0.08
(SEE NOTE 5)
SEE NOTE 3
(2 PLCS)
.004[.10]
.23 5.8
(SEE NOTE 7)
.230 5.84 REF
HAND FILL USING T-1S40
FIG 1
PATENT NUMBERS
SEE NOTE 8
FTSH-1XX-XX-XXX-DV SHOWN
(SEE FTSHC-1XX-XX-XXX-DX-XX PRINT FOR DETAILS)
5713755 / 5961339
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
ANGLES
1
.XX: .01 [.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
.XXX: .005 [.13]
PHONE: 812-944-6733
e-Mail info@SAMTEC.com
DESCRIPTION:
FAX: 812-948-5047
.XXXX: .0010 [.025]
code 55322
SHEET SCALE: 5:1
MATERIAL:
DO NOT SCALE DRAWING
.050 x .050 CL DOUBLE VERTICAL SMT TERMINAL STRIP
INSULATOR: LCP UL 94 VO
TERMINAL: PHOSPHOR BRONZE
NO.
DWG. FTSH-1XX-XX-XXX-DV-XXX
* = SEE NOTE 13
10/12/1995 SHEET 1 OF
BY: PURVIS
5
F:\DWG\MISC\MKTG\FTSH-1XX-XX-XXX-DV-XXX-MKT.SLDDRW
5秒后页面跳转
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
