Datasheet > FS32K112BHX0MLHTR

FS32K112BHX0MLHTR

更新时间： 2024-11-28 01:55:15

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
100页	1594K
描述
Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

FS32K112BHX0MLHTR 数据手册

浏览型号FS32K112BHX0MLHTR的Datasheet PDF文件第2页

浏览型号FS32K112BHX0MLHTR的Datasheet PDF文件第3页

浏览型号FS32K112BHX0MLHTR的Datasheet PDF文件第4页

浏览型号FS32K112BHX0MLHTR的Datasheet PDF文件第5页

浏览型号FS32K112BHX0MLHTR的Datasheet PDF文件第6页

浏览型号FS32K112BHX0MLHTR的Datasheet PDF文件第7页

Document Number S32K1XX

Rev. 12, 02/2020

NXP Semiconductors

Data Sheet: Technical Data

S32K1XX

S32K1xx Data Sheet

Notes

• Power management

– Low-power Arm Cortex-M4F/M0+ core with

excellent energy efficiency

• Supports S32K116, S32K118, S32K142, S32K142W,

S32K144, S32K144W, S32K146, and S32K148

– Technical information for S32K142W and

S32K144W device families is preliminary until

these devices achieve qualification

– Power Management Controller (PMC) with multiple

power modes: HSRUN, RUN, STOP, VLPR, and

VLPS. Note: CSEc (Security) or EEPROM writes/

erase will trigger error flags in HSRUN mode (112

MHz) because this use case is not allowed to

execute simultaneously. The device will need to

switch to RUN mode (80 MHz) to execute CSEc

(Security) or EEPROM writes/erase.

• The following two attachments are available with the

Datasheet:

– S32K1xx_Orderable_Part_Number_ List.xlsx

– S32K1xx_Power_Modes_Configuration.xlsx

– Clock gating and low power operation supported on

specific peripherals.

Key Features

• Operating characteristics

• Memory and memory interfaces

– Voltage range: 2.7 V to 5.5 V

– Up to 2 MB program flash memory with ECC

– 64 KB FlexNVM for data flash memory with ECC

and EEPROM emulation. Note: CSEc (Security) or

EEPROM writes/erase will trigger error flags in

HSRUN mode (112 MHz) because this use case is

not allowed to execute simultaneously. The device

will need to switch to RUN mode (80 MHz) to

execute CSEc (Security) or EEPROM writes/erase.

– Up to 256 KB SRAM with ECC

– Ambient temperature range: -40 °C to 105 °C for

HSRUN mode, -40 °C to 150 °C for RUN mode

• Arm™ Cortex-M4F/M0+ core, 32-bit CPU

– Supports up to 112 MHz frequency (HSRUN mode)

with 1.25 Dhrystone MIPS per MHz

– Arm Core based on the Armv7 Architecture and

Thumb®-2 ISA

– Integrated Digital Signal Processor (DSP)

– Configurable Nested Vectored Interrupt Controller

(NVIC)

– Up to 4 KB of FlexRAM for use as SRAM or

EEPROM emulation

– Single Precision Floating Point Unit (FPU)

– Up to 4 KB Code cache to minimize performance

impact of memory access latencies

– QuadSPI with HyperBus™ support

• Clock interfaces

– 4 - 40 MHz fast external oscillator (SOSC) with up

to 50 MHz DC external square input clock in

external clock mode

– 48 MHz Fast Internal RC oscillator (FIRC)

– 8 MHz Slow Internal RC oscillator (SIRC)

– 128 kHz Low Power Oscillator (LPO)

– Up to 112 MHz (HSRUN) System Phased Lock

Loop (SPLL)

• Mixed-signal analog

– Up to two 12-bit Analog-to-Digital Converter

(ADC) with up to 32 channel analog inputs per

module

– One Analog Comparator (CMP) with internal 8-bit

Digital to Analog Converter (DAC)

• Debug functionality

– Up to 20 MHz TCLK and 25 MHz SWD_CLK

– 32 kHz Real Time Counter external clock

(RTC_CLKIN)

– Serial Wire JTAG Debug Port (SWJ-DP) combines

– Debug Watchpoint and Trace (DWT)

– Instrumentation Trace Macrocell (ITM)

– Test Port Interface Unit (TPIU)

– Flash Patch and Breakpoint (FPB) Unit

• Human-machine interface (HMI)

– Up to 156 GPIO pins with interrupt functionality

– Non-Maskable Interrupt (NMI)

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

12 3 4 5 6 7...100

中文翻译

下载PDF

与FS32K112BHX0MLHTR相关器件

型号	品牌	获取价格	描述	数据表
FS32K112BHX0MLLTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0MLQTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0VLFTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0VLHTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0VLLTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0VLQTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0VLUTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0WLFTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0WLHTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency
FS32K112BHX0WLLTR	NXP	获取价格	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency

与FS32K112BHX0MLHTR相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

46
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

35
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

64
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

61

产品中心

服务支持

精选活动

关于我们

帮助中心

FS32K112BHX0MLHTR

FS32K112BHX0MLHTR 数据手册

与FS32K112BHX0MLHTR相关器件

与FS32K112BHX0MLHTR相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

FS32K112BHX0MLHTR

FS32K112BHX0MLHTR 数据手册

与FS32K112BHX0MLHTR相关器件

与FS32K112BHX0MLHTR相关文章

您还可以找

您在本页遇到什么问题？