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FOD8802C PDF预览

FOD8802C

更新时间: 2024-11-25 11:01:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
11页 311K
描述
Dual Channel OptoHiT™ Series, High-Temperature Phototransistor Optocoupler In Small Outline 8-Pin Package

FOD8802C 数据手册

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Dual Channel OptoHiTt  
Series, High-Temperature  
Phototransistor  
Optocoupler in Small  
Outline 8-Pin Package  
www.onsemi.com  
FOD8802 Series  
Description  
The FOD8802 dual channel optocoupler is a best−in−class  
phototransistor, optocoupler utilizing ON Semiconductor  
leading−edge proprietary process technology to achieve high  
operating temperature performance, up to 125°C. It consists of two  
aluminum gallium arsenide (AlGaAs) infrared light emitting diode  
optically coupled to two phototransistors, in a small outline, 8−pin  
SOIC package. It delivers consistent current transfer ratio at very low  
input current over temperature. The AlGaAs light ouput degradation  
performance is significantly better than the commodity optocoupler  
products that uses the standard GaAs, extending lifetime and reducing  
the guardband requirements to compensate for temperature drift. The  
SOIC8  
M SUFFIX  
CASE 751DZ  
MARKING DIAGRAM  
input−output isolation voltage, Viso, is rated at 2500 VAC  
.
RMS  
Features  
Excellent CTR Linearity at High Temperature  
CTR at Very Low Input Current, I  
F
High Isolation Voltage Regulated by Safety Agency, UL1577,  
1.  
2.  
3.  
4.  
5.  
6.  
ON = Corporate Name  
2500 VAC  
for 1 min.  
RMS  
8802x = Device Number  
V = DIN EN/IEC60747−5−5 Option  
X = One−Digit Year Code  
YY = Digit Work Week  
Applicable to Infrared Ray Reflow, 260°C  
These are Pb−Free Devices  
S = Assembly Package Code  
Typical Applications  
Primarily Suited for DC−DC Converters  
For Ground Loop Isolation, Signal to Noise Isolation  
Communications – Adapters, Chargers  
PIN CONNECTIONS  
Consumer – Appliances, Set Top Boxes  
Industrial – Power Supplies, Motor Control, Programmable Logic  
Control  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 9 of this data sheet.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
April, 2020 − Rev. 0  
FOD8802/D  

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