Datasheet > FMESD05C

FMESD05C

更新时间： 2024-01-10 02:59:45

品牌	Logo	应用领域
未来芯 - FUTUREWAFER		/
页数	文件大小	规格书
5页	650K
描述
Small Package ESD Protection

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中文翻译

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数据手册

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FMESD05C 数据手册

FMESD05C

Small Package ESD Protection

Applications

● Lan equipment

● Video

● DVI

● High Speed Data Line

● Ethernet

● USB 2.0 Power and Data line Protection

Feature

● With TVS Diode

DFN1006-2L

● ESD Protection:Level 4

● Low clamping voltage

● 75Watts peak pulse power per line(tp=8/20uS)

● Ultra low capacitance:20pf max.(any I/O to GND.)

● Protection one line I/O port

Mechanical Characteristics

● Molded JEDEC DFN1006 package

● Packging:Tape and Reel

● Flammability rating UL 94V-0

● Halgen Free

IEC Compatibility

● EN61000-4

● 61000-4-2(ESD):LEVEL 4,Air:8kv,contact:15kv

● 61000-4-4(EFT):40A-5/50ns

● 61000-4-5(Surge):3A-8/20us

Device Characteristics

Maximum Ratings@25 unless otherwise specified

Parameter

Symbol

Value

Units

Peak pulse power (tp=8/20us)

Operating Temperature

Storage Temperature

PPP

Watts

-55~150

-65~150

°C

TSTG

Futurewafer Technology co., Ltd.,

E1509F2A-STD-FW-036

12 3 4 5

中文翻译

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