Datasheet > FM540-BF-H

FM540-BF-H

更新时间： 2025-07-24 18:42:55

品牌	Logo	应用领域
美丽微 - FORMOSA		/
页数	文件大小	规格书
7页	139K
描述
STATUS : Active; Package : SMB-F; IO(A) : 5; VRRM(V) : 40; VF Max.(V)@IF : 0.55; IF(A) : 5; IR Max.(μA)@VR : 500; VR(V) : 40; AEC-Q101Qualified : No;

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中文翻译

获取价格

数据手册

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FM540-BF-H 数据手册

SMD Schottky Barrier Rectifier

Formosa MS

FM520-BF THRU FM5200-BF

Reel packing

APPROX.

GROSS WEIGHT

INNER

BOX

REEL

DIA,

CARTON

SIZE

COMPONENT

SPACING

BOX

(pcs)

CARTON

(pcs)

REEL

(pcs)

PACKAGE REEL SIZE

(m/m)

(kg)

(m/m)

3,000

6,000

48,000

SMB-F

13"

8.0

337*337*37

330

350*330*360

12.40

Suggested thermal profiles for soldering processes

1.Storage environment: Temperature=5^oC~40^oC Humidity=55% 25%

2.Reflow soldering of surface-mount devices

Critical Zone

TL to TP

Ramp-up

Tsmax

Tsmin

Preheat

Ramp-down

t25^oC to Peak

Time

3.Reflow soldering

Profile Feature

Soldering Condition

Average ramp-up rate(TL to TP)

<3^oC/sec

Preheat

-Temperature Min(Tsmin)

-Temperature Max(Tsmax)

-Time(min to max)(ts)

150^oC

200^oC

60~120sec

Tsmax to TL

-Ramp-upRate

<3^oC/sec

Time maintained above:

-Temperature(TL)

-Time(tL)

217^oC

60~260sec

Peak Temperature(TP)

255^oC-0/+5^oC

10~30sec

Time within 5^oC of actual Peak

Temperature(tP)

Ramp-down Rate

<6^oC/sec

Time 25^oC to Peak Temperature

<6minutes

http://www.formosams.com

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

DS-22166F

Issued Date

2019/03/12

Revised Date

2021/09/23

Revision

Page.

Page 6

1...3 4 567

中文翻译

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