FM301B
THRU
RECTRON
SEMICONDUCTOR
TECHNICAL SPECIFICATION
FM307B
SURFACE MOUNT
GLASS PASSIVATED SILICON RECTIFIER
VOLTAGE RANGE 50 to 1000 Volts CURRENT 3.0 Amperes
FEATURES
* Glass passivated device
* Ideal for surface mounted applications
* Low leakage current
* Metallurgically bonded construction
* Mounting position: Any
* Weight: 0.098 gram
DO-214AA
MECHANICAL DATA
* Epoxy : Device has UL flammability classification 94V-0
(
)
0.083 2.11
(
)
)
0.155 3.94
(
)
0.077 1.96
(
0.130 3.30
(
)
0.180 4.57
(
)
0.160 4.06
(
)
0.012 0.305
(
)
0.006 0.152
(
)
)
)
0.096 2.44
(
0.084 2.13
(
0.060 1.52
(
)
)
0.008 0.203
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
(
)
0.030 0.76
(
0.004 0.102
(
)
)
0.220 5.59
(
0.205 5.21
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (At T
A
= 25oC unless otherwise noted)
RATINGS
SYMBOL
FM301B FM302B FM303B FM304B FM305B FM306B FM307B UNITS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
V
V
RRM
50
35
50
100
70
200
140
200
400
280
400
3.0
600
420
600
800
560
800
1000
700
Volts
Volts
Volts
Amps
RMS
Maximum DC Blocking Voltage
V
DC
O
100
1000
Maximum Average Forward Rectified Current T
A
= 75oC
I
Peak Forward Surge Current IFM(surge): 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
I
FSM
100
Amps
(Note 2) RθJL
(Note 3) RθJA
10
0C/W
0C/W
pF
Typical Thermal Resistance
35
60
Typical Junction Capacitance (Note 1)
CJ
T
J
, TSTG
-55 to + 150
0 C
Operating and Storage Temperature Range
ELECTRICAL CHARACTERISTICS (At T
CHARACTERISTICS
Maximum Forward Voltage at 3.0A DC
Maximum Full Load Reverse Current,
A
= 25oC unless otherwise noted)
SYMBOL
FM301B FM302B FM303B FM304B FM305B FM306B FM307B UNITS
V
F
1.1
30
Volts
uAmps
o
Full cycle Average at TA= 75 C
I
R
@T
@T
A
A
= 25oC
= 125oC
uAmps
uAmps
5.0
Maximum DC Average Reverse Current at
Rated DC Blocking Voltage
250
NOTES : 1. Measured at 1.0 MHz and applied average voltage of 4.0VDC
2002-6
2. Thermal resistance junction to terminal, 10.0X10.0mm2 copper pads to each terminal.
3. Thermal resistance junction to ambient, 10.0X10.0mm2 copper pads to each terminal.