是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | LFBGA, BGA64,8X8,32 | 针数: | 64 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.24 | Is Samacsys: | N |
数据速率: | 100000 Mbps | JESD-30 代码: | S-PBGA-B64 |
JESD-609代码: | e0 | 长度: | 7 mm |
功能数量: | 1 | 端子数量: | 64 |
收发器数量: | 1 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA64,8X8,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 1.36 mm |
子类别: | Network Interfaces | 最大压摆率: | 0.11 mA |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 电信集成电路类型: | ETHERNET TRANSCEIVER |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7 mm | Base Number Matches: | 1 |
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