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FHR20X PDF预览

FHR20X

更新时间: 2024-11-28 20:58:19
品牌 Logo 应用领域
富士通 - FUJITSU /
页数 文件大小 规格书
4页 66K
描述
RF Small Signal Field-Effect Transistor, 1-Element, KA Band, Gallium Arsenide, N-Channel, High Electron Mobility FET, DIE

FHR20X 技术参数

生命周期:Obsolete包装说明:UNCASED CHIP, R-XUUC-N
Reach Compliance Code:compliant风险等级:5.37
其他特性:LOW NOISE, HIGH RELIABILITY配置:SINGLE
最小漏源击穿电压:3.5 VFET 技术:HIGH ELECTRON MOBILITY
最高频带:KA BANDJESD-30 代码:R-XUUC-N
元件数量:1工作模式:DEPLETION MODE
最高工作温度:175 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:UNCASED CHIP
极性/信道类型:N-CHANNEL功耗环境最大值:0.1 W
最小功率增益 (Gp):8.5 dB认证状态:Not Qualified
子类别:FET RF Small Signal表面贴装:YES
端子形式:NO LEAD端子位置:UPPER
晶体管应用:AMPLIFIER晶体管元件材料:GALLIUM ARSENIDE
Base Number Matches:1

FHR20X 数据手册

 浏览型号FHR20X的Datasheet PDF文件第2页浏览型号FHR20X的Datasheet PDF文件第3页浏览型号FHR20X的Datasheet PDF文件第4页 
FHR20X  
GaAs FET & HEMT Chips  
FEATURES  
• Low Noise Figure: 0.75dB (Typ.)@f=18GHz  
• High Associated Gain: 10.0dB (Typ.)@f=18GHz  
• Lg 0.15µm, Wg = 100µm  
• Gold Gate Metallization for High Reliability  
DESCRIPTION  
The FHR20X is a Super High Electron Mobility Transistor  
(SuperHEMTTM) intended for general purpose, ultra-low noise and  
high gain amplifiers in the 2-30GHz frequency range. The device is  
well suited for telecommunication and low noise millimeter wave  
applications.  
Fujitsu’s stringent Quality Assurance Program assures the highest  
reliability and consistent performance.  
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25°C)  
Item  
Symbol  
Condition  
Unit  
Rating  
Drain-Source Voltage  
Gate-Source Voltage  
Total Power Dissipation  
V
V
3.5  
-3.0  
100  
V
V
DS  
GS  
Note  
P
mW  
tot  
Storage Temperature  
Channel Temperature  
T
-65 to +175  
175  
°C  
°C  
stg  
T
ch  
Note: Mounted on Al O board (30 x 30 x 0.65mm)  
2
3
Fujitsu recommends the following conditions for the reliable operation of GaAs FETs:  
1. The drain-source operating voltage (V ) should not exceed 2 volts.  
DS  
2. The forward and reverse gate currents should not exceed 0.1 and -0.025 mA respectively with  
gate resistance of 4000.  
3. The operating channel temperature (T ) should not exceed 80°C.  
ch  
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25°C)  
Limit  
Typ.  
Item  
Symbol  
Test Conditions  
Unit  
Min.  
Max.  
V
V
= 2V, V  
= 0V  
GS  
Saturated Drain Current  
Transconductance  
I
5
15  
30  
-
mA  
DS  
DS  
DSS  
g
= 2V, I  
= 5mA  
m
20  
30  
mS  
V
DS  
Pinch-off Voltage  
V
V
I
= 2V, I = 0.5mA  
DS  
-0.1 -0.7  
-1.5  
-
p
DS  
Gate Source Breakdown Voltage  
Noise Figure  
V
-
V
= -5µA  
-3.0  
GSO  
NF  
GS  
0.75 0.90  
dB  
-
V
= 2V  
= 5mA  
DS  
I
DS  
G
-
Associated Gain  
8.5  
10.0  
450  
dB  
as  
th  
f = 18GHz  
R
Thermal Resistance  
Channel to Case  
-
600  
°C/W  
Note: RF parameter sample size 10pcs. criteria (accept/reject)=(2/3)  
The chip must be enclosed in a hermetically sealed environment for optimum performance and reliability.  
Edition 1.2  
July 1999  
1

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