Datasheet > FESD05HD

FESD05HD

更新时间： 2022-02-26 12:50:33

品牌	Logo	应用领域
未来芯 - FUTUREWAFER		/
页数	文件大小	规格书
4页	767K
描述
High Power Small Package ESD Protection

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数据手册

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FESD05HD 数据手册

FESD05HD

High Power Small Package ESD Protection

Applications

● Lan equipment

● Video

● DVI

● High Speed Data Line

● Ethernet

● USB 2.0 Power and Data line Protection

Feature

● With TVS Diode

● ESD Protection:Level 4

● Low clamping voltage

● 150Watts peak pulse power per line(tp=8/20uS)

● Ultra low capacitance:40pf max.(I/O to GND.)

DFN1006

IEC Compatibility

● EN61000-4

● 61000-4-2(ESD):LEVEL 4,Air:15kv,contact:8kv

● 61000-4-4(EFT):40A-5/50ns

● 61000-4-5(Surge):12A-8/20us

Mechanical Characteristics

● Molded JEDEC DFN1006 package

● Packging:Tape and Reel

● Flammability rating UL 94V-0

● Halogen Free

Device Characteristics

Maximum Ratings@25 unless otherwise specified

Parameter

Symbol

PPP

Value

170

Units

Watts

°C

Peak pulse power (tp=8/20us) (fig. 3)

Operating Temperature

-55~150

Storage Temperature

TSTG

-55~150

°C

E1508F11D-STD-FW-001

Futurewafer Technology co., Ltd.,

12 3 4

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