Datasheet > FESD3V3B

FESD3V3B

更新时间： 2024-10-02 01:16:43

品牌	Logo	应用领域
未来芯 - FUTUREWAFER		/
页数	文件大小	规格书
3页	546K
描述
Low capacitance ESD protection

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中文翻译

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数据手册

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FESD3V3B 数据手册

FESD3V3B

Low capacitance ESD protection

Applications

● Lan equipment

● Video

● DVI

● High Speed Data Line

● Ethernet

● USB 2.0 Power and Data line Protection

Feature

● With TVS Diode

● ESD Protection:Level 4

● Low clamping voltage

SOD523

● 100 Watts peak pulse power per line(tp=8/20uS)

● Ultra low capacitance:15pf max.(any I/O to GND.)

● Protection one line I/O port

IEC Compatibility

● EN61000-4

Mechanical Characteristics

● Molded JEDEC SOD523 package

● Packging:Tape and Reel

● Flammability rating UL 94V-0

● Halgen Free

● 61000-4-2(ESD):Level4,

Contact:±8kv, Air:±15kv

● 61000-4-4(EFT):40A-5/50ns

● 61000-4-5(Surge):4A-8/20us

Device Characteristics

Maximum Ratings@25 unless otherwise specified

Parameter

Peak pulse power (tp=8/20us)

Operating Temperature

Symbol

Value

100

Units

Watts

°C

PPP

-55~150

Storage Temperature

TSTG

-55~150

°C

STD-A 2016-01

Futurewafer Technology Co.,Ltd

12 3

中文翻译

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