Specifications for Wire Wound Chip Common Mode Choke Coil
10. Reliability Test
Items
Requirements
Test Methods and Remarks
1. Solder on PCB to Reflow test Peak Temp. 260±5℃ 5~10
secs ,Cycles :2 times..Re-flowing Profile: Please refer to Fig-1
2. Test board thickness: 1.5mm
Resistance to
1. No visible mechanical damage
Soldering Heat 2. Impedance change: Within±20%
3. Test board material: glass epoxy resin
4. The specimen shall be stored at standard atmospheric
conditions for 1 hour, after which the measurement shall be
made.product showed no damage under microscope.
Fig-1
High
1. No visible mechanical damage
1. Temperature: 125±2℃
Temperature
2. Impedance change: Within±20% 2. Duration: 1000 hours
The specimen shall be stored at standard atmospheric
conditions for 1 hour, after which the measurement
shall be made.
Steady
1. No visible mechanical damage
1. Temperature:85℃
damp-heat
2. Impedance change: Within±20% 2. Humidity: 85% RH
3. Duration:1000 hours
4. The specimen shall be stored at standard
atmospheric conditions for 1 hour, after which the
measurement shall be made.
Mechanical
Vibration
1.No visible mechanical damage
1.Frequency: 10HZ~55HZ~10HZ/Min Cycles
2.Amplitude: 1.5 mm
2.Impedance change: Within±20%
3.Directions: X,Y,Z
4.Time: 2 hours in each directions (total of 6 hours)
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