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FDB2670_NL

更新时间: 2024-11-15 19:27:19
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关脉冲晶体管
页数 文件大小 规格书
5页 83K
描述
Power Field-Effect Transistor, 19A I(D), 200V, 0.13ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, LEAD FREE, D2PAK-3

FDB2670_NL 技术参数

生命周期:Obsolete零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.76雪崩能效等级(Eas):375 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (ID):19 A
最大漏源导通电阻:0.13 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):40 A认证状态:Not Qualified
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDB2670_NL 数据手册

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November 2001  
FDP2670/FDB2670  
200V N-Channel PowerTrench MOSFET  
General Description  
Features  
This N-Channel MOSFET has been designed  
specifically for switching on the primary side in the  
isolated DC/DC converter application. Any application  
requiring a 200V MOSFETs with low on-resistance and  
fast switching will benefit.  
19 A, 200 V. RDS(ON) = 130 m@ VGS = 10 V  
Low gate charge (27 nC typical)  
Fast switching speed  
These MOSFETs feature faster switching and lower  
gate charge than other MOSFETs with comparable  
RDS(ON) specifications.  
High performance trench technology for extremely  
low RDS(ON)  
The result is a MOSFET that is easy and safer to drive  
(even at very high frequencies), and DC/DC power  
supply designs with higher overall efficiency.  
High power and current handling capability  
D
D
G
G
G
S
TO-263AB  
FDB Series  
TO-220  
FDP Series  
D
S
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
Drain-Source Voltage  
Ratings  
Units  
V
200  
VGSS  
Gate-Source Voltage  
V
± 20  
19  
ID  
Drain Current – Continuous  
– Pulsed  
(Note 1)  
(Note 1)  
A
40  
A
PD  
93  
W
Total Power Dissipation @ TC = 25°C  
0.63  
3.2  
Derate above 25°C  
W°/C  
dv/dt  
Peak Diode Recovery dv/dt  
(Note 3)  
V/ns  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–65 to +175  
°C  
Thermal Characteristics  
RθJC  
Thermal Resistance, Junction-to-Case  
1.6  
°C/W  
°C/W  
RθJA  
Thermal Resistance, Junction-to-Ambient  
62.5  
Package Marking and Ordering Information  
Device Marking  
Device  
FDB2670  
FDP2670  
Reel Size  
Tape width  
24mm  
Quantity  
FDB2670  
13’’  
800 units  
45 units  
FDP2670  
Tube  
n/a  
FDP2670/FDB2670 Rev C1(W)  
2001 Fairchild Semiconductor Corporation  

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