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FCP20N60FS PDF预览

FCP20N60FS

更新时间： 2024-11-24 01:21:43
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
14页 298K
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DESIGN/PROCESS CHANGE NOTIFICATION

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FCP20N60FS 数据手册

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PCN# : P315A  
Issue Date : Feb. 04, 2013  
DESIGN/PROCESS CHANGE NOTIFICATION  
This is to inform you that a change is being made to the products listed below.  
Unless otherwise indicated in the details of this notification, the identified change will have no impact on product  
quality, reliability, electrical, visual or mechanical performance and affected products will remain fully compliant to all  
published specifications. Products incorporating this change may be shipped interchangeably with existing unchanged  
products.  
This change is planned to take effect in 90 calendar days from the date of this notification. Please work with your local  
Fairchild Sales Representative to manage your inventory of unchanged product if your evaluation of this change will  
require more than 90 calendar days.  
Please contact your local Customer Quality Engineer within 30 days of receipt of this notification if you require any  
additional data or samples. Alternatively, you may send an email request for data, samples or other information to  
PCNSupport@fairchildsemi.com.  
Implementation of change:  
Expected First Shipment Date for Changed Product : May. 05, 2013  
Expected First Date Code of Changed Product :1327  
Description of Change (From) :  
5/6-in wafer fabrication line at Fairchild Semiconductor Bucheon Korea.  
Description of Change (To) :  
8-in wafer fabrication line at Fairchild Semiconductor Bucheon Korea.  
Reason for Change:  
Fairchild Semiconductor is increasing wafer fabrication capacity by qualifying an 8-in wafer fabrication line at Fairchild  
Semiconductor Bucheon Korea. Quality and reliability remain at the highest standards already demonstrated within  
Fairchild's existing products. The reliability qualification results used to qualify the 8-in wafer fabrication line are  
summarized below. The specific groups of products/MOSFET technologies are listed in the affected FSIDs list. Design,  
die size and layout of the affected products will remain unchanged. There are no changes in the datasheet or electrical  
performance.  
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