Electrical Characteristics (Continued)
Unless otherwise noted, VDD=12V, TJ=-40°C to +125°C. Currents are defined as positive into the device and negative
out of the device.
Symbol
Output
Parameter
Conditions
Min. Typ. Max. Unit
OUT at VDD/2,
CLOAD=0.22µF, f=1kHz
ISINK
OUT Current, Mid-Voltage, Sinking(10)
4.3
A
A
OUT at VDD/2,
CLOAD=0.22µF, f=1kHz
ISOURCE
IPK_SINK
OUT Current, Mid-Voltage, Sourcing(10)
OUT Current, Peak, Sinking(10)
-2.8
CLOAD=0.22µF, f=1kHz
CLOAD=0.22µF, f=1kHz
5
A
A
IPK_SOURCE OUT Current, Peak, Sourcing(10)
-5
VOH
High Level Output Voltage
15
35
mV
VOH = VDD – VOUT, IOUT = –1mA
VOL
tRISE
tFALL
Low Level Output Voltage
Output Rise Time(11)
Output Fall Time(11)
IOUT = 1mA
10
12
9
25
20
17
mV
ns
CLOAD=2200pF
CLOAD=2200pF
ns
Output Propagation Delay, CMOS
Inputs(12)
tD1, tD2
tD1, tD2
0 - 12VIN, 1V/ns Slew Rate
9
9
18
17
2
34
29
4
ns
ns
Output Propagation Delay, TTL Inputs(12) 0 - 5VIN, 1V/ns Slew Rate
INA=INB, OUTA and OUTB
at 50% point
TDEL.MATCH Propagation Matching Between Channels
ns
IRVS
Output Reverse Current Withstand(10)
500
mA
Notes:
8. Lower supply current due to inactive TTL circuitry.
9. EN inputs have TTL thresholds; refer to the ENABLE section
10. Not tested in production.
11. See Timing Diagrams of Figure 9 and Figure 10.
12. See Timing Diagrams of Figure 7 and Figure 8.
© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN3223 / FAN3224 / FAN3225_F085 • Rev. 1.0.0
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