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F0453BLEGK PDF预览

F0453BLEGK

更新时间: 2022-06-24 15:41:14
品牌 Logo 应用领域
艾迪悌 - IDT /
页数 文件大小 规格书
35页 2354K
描述
Dual Path RF Switch with LNA and DVGA 3300MHz to 4000MHz

F0453BLEGK 数据手册

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F0453B Datasheet  
Recommended Operating Conditions  
Table 3.  
Recommended Operating Conditions  
Parameter  
Symbol  
VDD  
Condition  
Minimum  
3.15  
Typical  
Maximum  
3.45  
Units  
V
Power Supply Voltage  
3.3  
Operating Temperature Range  
RF Frequency Range  
TEPAD  
fRF  
Exposed Paddle  
-40  
+105  
°C  
3300  
4000  
MHz  
Tx Mode CW Average Input Power,  
+7.5dB PAR, Full Life Time [a]  
PMAX_TX  
89% Duty Cycle  
89% Duty Cycle  
+30 [b]  
-25  
dBm  
dBm  
50Ω, VDD = +3.3V  
Rx Mode CW Average Input Power,  
+7.5dB PAR, Full Life Time [a]  
PMAX_RX  
50Ω, VDD = +3.3V  
Port Impedance (SW1_IN, SW2_IN,  
RX1_OUT, RX2_OUT)  
ZRF  
TJ  
50  
Ω
Junction Temperature  
+125  
°C  
[a] Assumes device environmental temperature cycling within the specified exposed pad operating temperature range of -40°C and 105°C and a  
maximum junction temperature of 125°C.  
[b] Operation beyond the maximum recommended operating input power level should be limited and have reduced exposed pad temperatures to  
maintain device reliability per foundry guidelines (see Figure 2). Electrical characteristics and lifetime are not guaranteed for RF input power  
levels beyond what is specified in this table.  
[c]  
Figure 2. Typical TX Input Power and Reduced Exposed Pad Temperature Profile  
Average Input Power +7.5dB PAR  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
60  
65  
70  
75  
80  
85  
90  
95 100 105 110 115  
Exposed Pad Temperature (°C)  
[c] Profile represents estimates to maintain maximum junction temperature ≤ 125°C using IDT specific evaluation board and test environment.  
© 2019 Integrated Device Technology, Inc.  
8
December 9, 2019  
 
 
 
 

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