F0453B Datasheet
Pin Descriptions
Table 1.
Pin Descriptions
Number
Name
Description
1-bit 6dB gain control for path 1. (Low/open = no attenuation; High = 6dB attenuation). A 500kΩ pull-down
resistor is connected between this input and GND.
1
2
ATT1_CTRL
STBY1
Standby (Low/open = path 1 power ON; High = path 1 power OFF). A 500kΩ pull-down resistor is connected
between this input and GND.
RF SWITCH 1 control (Low/open = select main RX PATH 1; High = termination). SW1_CTRL also puts path 1
into Standby Mode for minimum current consumption. A 500kΩ pull-down resistor is connected between this
input and GND.
3
SW1_CTRL
GND
4, 5, 9, 11,
13, 15, 17,
19, 20, 21,
22, 24, 26,
28, 30, 32
Ground these pins.
Power supply. Bypass to GND with capacitors shown in the F0453B Application Circuit (see Figure 29) as close
as possible to pin.
12, 14, 27, 29
VDD
SW2_CTRL
STBY2
RF SWITCH 2 control (Low/open = select main RX PATH 2; High = termination). SW2_CTRL also puts path 2
into Standby Mode for minimum current consumption. A 500kΩ pull-down resistor is connected between this
input and GND.
6
7
Standby (Low/open = path 2 power ON; High = path 2 power OFF). A 500kΩ pull-down resistor is connected
between this input and GND.
1-bit 6dB gain control for path 2. (Low/open = no attenuation; High = 6dB attenuation). A 500kΩ pull-down
resistor connects between this input and GND.
8
ATT2_CTRL
RX2_OUT
SW2_OUT
10
16
RF output path 2 matched to 50Ω. Use external DC block as close to the pin as possible.
RF2 switch output matched to 50Ω. Use external 50Ω terminating resistor with proper power rating as required
for the application.
18
23
SW2_IN
SW1_IN
RF2 switch input matched to 50Ω. Use external DC block as close to the pin as possible.
RF1 switch input matched to 50Ω. Use external DC block as close to the pin as possible.
RF1 switch output matched to 50Ω. Use external 50Ω terminating resistor with proper power rating as required
for the application
25
31
SW1_OUT
RX1_OUT
RF output path 1 matched to 50Ω. Use external DC block as close to the pin as possible.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground
vias to provide heat transfer out of the device into the PCB ground planes. These multiple via grounds are also
required to achieve the noted RF performance.
— EPAD
© 2019 Integrated Device Technology, Inc.
6
December 9, 2019