EX-219
Hi-Reliability Evacuated Miniature Crystal Oscillator (EMXO)
13. Internal Gas Analysis (IGA)
IGA is not applicable to space EMXO. After pre-seal vacuum
baking, EMXO is hermetically sealed under hard vacuum. At
time of seal, the vaccum level is at 1e-6 torr or better. At this
level of vaccum pressure, the moisture and any other gasses
are insignificant relative to the limit specified in MIL-STD-883,
TM 1018. Although IGA can probably be performed on
evacuated package, the result will be grossly obscured and
inaccurate due to hard vacuum.
14. Other Typical Parameters
Phase Noise: 10MHz
Figure 10c: Delta Frequency with Burt Jumps
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
12. Leak Test
Most hermetically sealed packages are back filled with a gas
or gasses mixed with some low percentage of detective gas
such as He at around 1atm pressure and then are sealed
using resistance weld or seam weld methods. Packages
sealed in this manner have a typical leak rate of 1x10-10 to
1x10-9 atm cc/sec. Therefore, a leak detector having 1x10-8
atm cc/sec resolution and accuracy will be sufficient to
perform the leak test.
1
10
100
1,000
10,000
100,000
Offset Frequency (Hz)
On the other hand, the EMXO package is hermetically sealed
using a cold-weld process and evacuated under hard vacuum
during welding. The cold-weld package is typically used for
crystals and achieves a leak rate better than 1x10-12 atm
cc/sec He. The internal vacuum level at seal is better than
1x10-5 torr. To maintain performance over a mission life of 15
years, the EX-219 package leak rate should achieve 1x10-11
Figure 10
atm cc/sec He or better. To perform a leak test at this level
presents a challenging task. A Krypton-85 leak detector can
test leak rates down to this level but the bomb duration is very
long and may not be practical for manufacturing.
Contrary to most electronic devices, the EMXO has
a
proportionally controlled oven whereby power consumption is
inversely proportional to thermal resistance from the oven to
the case. In this case, the EMXOs vacuum is utilized for
thermal insulation. If the vacuum degrades as a result of a
leak, the power consumption will be much higher. Hence,
electrical parameters such as power consumption and
frequency aging can determine package hermeticity. Please
request Vectron’s EMXO white paper for additional detailed
information on package hermiticity.
Figure 11 (10MHz)
Contact Information
Europe:
USA:
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Landstrasse
Mt Holly Springs, PA 17065
Tel: 1.717.486.3411
Fax: 1.717.486.5920
74924 Neckarbischofsheim
Germany
Tel: +49 (0) 7268.801.0
Fax: +49 (0) 7268.801.281
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATION OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION INCLUDING, BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of
Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed,
implicitly, or otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip and Vectron names, the Microchip and Microchip/Vectron logo, are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
4/6/2023 SEM/NV
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