ES07B, ES07D
Vishay Semiconductors
www.vishay.com
Ultrafast Rectifier Surface Mount
FEATURES
• For surface mounted applications
• Low profile package
• Ideal for automated placement
• Glass passivated pallet chip junction
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
• Meets JESD 201 class 2 whisker test
• Wave and reflow solderable
• AEC-Q101 qualified
17249
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
Case: DO-219AB (SMF)
Polarity: band denotes cathode end
Weight: approx. 15 mg
Packaging codes / options:
GS18/10K per 13" reel (8 mm tape)
GS08/3K per 7" reel (8 mm tape)
Int. construction: single
PARTS TABLE
PART
ORDERING CODE
MARKING
REMARKS
Tape and reel
Tape and reel
ES07B
ES07D
ES07B-GS18 or ES07B-GS08
ES07D-GS18 or ES07D-GS08
EB
ED
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
PART
SYMBOL
VALUE
UNIT
ES07B
ES07D
ES07B
ES07D
ES07B
ES07D
VRRM
VRRM
VRMS
VRMS
VDC
100
200
70
V
V
V
V
V
V
A
A
A
Maximum repetitive peak reverse voltage
Maximum RMS voltage
140
100
200
1.2
0.5
30
Maximum DC blocking voltage
VDC
T
tp = 109 °C
IF(AV)
IF(AV)
IFSM
Maximum average forward rectified current
TA = 65 °C (1)
Peak forward surge current 8.3 ms single half sine-wave
TL = 25 °C
Note
(1)
Mounted on epoxy glass PCB with 3 mm x 3 mm Cu pads ( 40 μm thick)
THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
Thermal resistance junction to ambient air (1)
RthJA
180
K/W
°C
Operating junction and storage temperature range
Tj, Tstg
-55 to 150
Note
(1)
Mounted on epoxy glass PCB with 3 mm x 3 mm Cu pads ( 40 μm thick)
Rev. 2.0, 19-Feb-15
Document Number: 85737
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000