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ERB21B5C2E510JDX1B PDF预览

ERB21B5C2E510JDX1B

更新时间： 2024-11-20 21:12:07
品牌 Logo 应用领域
村田 - MURATA 电容器
页数 文件大小 规格书
1页 18K
描述
Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000051uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT

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ERB21B5C2E510JDX1B 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：, 0805
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8532.24.00.20风险等级：5.84
电容：0.000051 µF电容器类型：CERAMIC CAPACITOR
介电材料：CERAMIC高度：1.35 mm
长度：2 mm安装特点：SURFACE MOUNT
多层：Yes负容差：5%
端子数量：2最高工作温度：125 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
封装形式：SMT包装方法：BULK
正容差：5%额定（直流）电压（URdc）：250 V
系列：ERB尺寸代码：0805
表面贴装：YES温度特性代码：C0G
温度系数：30ppm/Cel ppm/ °C端子形状：WRAPAROUND
宽度：1.25 mmBase Number Matches：1

ERB21B5C2E510JDX1B 数据手册

  
Capacitors > Monolithic Ceramic Capacitors  
Data Sheet  
Monolithic Ceramic Capacitors (High Frequency Type)  
ERB21B5C2E510JDX1p (0805, C0G, 51pF, 250Vdc)  
p: packaging code  
o For your new designs, alternative parts should be used. These parts should be used only for existing design. Please consult with us for details.  
RoHS regulation conformity parts  
e
g
e
L
W
(in mm)  
I Dimensions  
I Packaging  
Length L  
2.0mm 0.3mm  
1.25mm 0.3mm  
1.35mm+0mm  
0.25mm min.  
0.7mm  
Code  
Packaging  
180mm Embossed Tape  
330mm Embossed Tape  
Bulk(Bag)  
Minimum Quantity  
Width W  
Thickness T  
L
K
B
3000  
10000  
1000  
Electrode e  
Electrode Gap g (min.)  
I Specifications  
I Rated Value  
Please refer to  
'ERB Series Specification and Test Methods'  
PDF file.  
Murata PN Code  
Spec  
Temperature Char.  
Capacitance  
5C  
510  
J
C0G (EIA), 0 30ppm/°C  
51pF  
5%  
Capacitance Tol.  
Rated Voltage  
2E  
250Vdc  
o
This data sheet is applied for CHIP MONOLITHIC CERAMIC CAPACITOR used for General Electronics equipment for your design.  
<Notice>  
o
Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin  
melting point is used. Please confirm the solderability of Tin plating termination chip before use.  
Use of Sn-Zn based solder will deteriorate reliability of MLCC. Please check with our sales represetatives for the use of Sn-Zn based solder in advance.  
o
• The RoHS compliance means that we judge from EU Directive 2002/95/EC the products do not contain lead, cadmium, mercury, hexavalent  
chromium, PBB and PBDE, except exemptions stated in EU Directive 2002/95/EC annex and impurities existing in natural world.  
• This statement does not insure the compliance of any of the listed parts with any laws or legal imperatives developed by any EU members  
individually with regards to the RoHS Directive.  
!
Note:  
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our  
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.  
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product  
specifications or transact the approval sheet for product specifications before ordering.  
2010.11.4  
http://www.murata.com/  
1

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