EN71NS128B0
Pin Description
Signal
Description
A22–A16
Address Inputs
A/DQ15–A/DQ0 Multiplexed Address / Data input / output
CE#
OE#
Chip Enable Input. Asynchronous relative to CLK for the Burst mode.
Output Enable Input. Asynchronous relative to CLK for the Burst mode.
WE#
Write Enable Input.
VCCQ/VCC
VSSQ/GND
NC
Device Power Supply (1.65 V–1.95 V).
Ground
No Connect; not connected internally
RDY
Ready output; indicates the status of the Burst read. VOL = data invalid, VOH = data valid.
The first rising edge of CLK in conjunction with AVD# low latches address input and
activates burst mode operation. After the initial word is output, subsequent rising edges
of CLK increment the internal address counter. CLK should remain low during
asynchronous access.
CLK
Address Valid input. Indicates to device that the valid address is present on the address
inputs (address bits A15–A0 are multiplexed, address bits A21–A16 are address only).
VIL = for asynchronous mode, indicates valid address; for burst mode, causes starting
address to be latched on rising edge of CLK.
AVD#
VIH = device ignores address inputs
RESET#
WP#
Hardware reset input. VIL = device resets and returns to reading array data
Hardware write protect input. VIL = disables writes to SA129-130. Should be at VIH for all
other conditions.
At 11 V, accelerates programming; automatically places device in Accelerated Program
mode. At VIL, disables program and erase functions. Should be at VIH for all other
conditions. (Applying high voltage on MCP package is prohibited; otherwise, internal
RAM may be damaged easily!)
ACC
CRE
Control register enable: when CRE is high, WRITE operations laod the RCR or BCR,
and READ operations access the RCR, BCR, or DIDR.
Lower byte enable. DQ7~DQ0
LB#
UB#
Upper byte enable. DQ8~DQ15
Provides data-valid feedback during burst READ and WRITE operations, WAIT is used
to arbitrate collisions between refresh and wrapping within the burst length. WAIT should
be ignored during asynchronous operation. WAIT is High-Z when CE# is HIGH
WAIT
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.eonssi.com
4
Rev. A, Issue Date: 2009/7/24