Datasheet > EM7180SFP

EM7180SFP

更新时间： 2022-02-26 13:08:18

品牌	Logo	应用领域
EMMICRO		/
页数	文件大小	规格书
18页	1158K
描述
Ultra Low Power Sensor Fusion Platform

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EM7180SFP 数据手册

EM7180SFP

5. Typical Application Circuit

V_DD

2.4k

V_DD

V_REG

SCL

SCLS

Sensor

Fusion

SDA

Host MCU

SDAS

Platform

Host_Int

GPIO

SA0

GND

Fig. 12 Sensor Fusion Platform Connection to Host MCU

6. Package Information

6.1. Module dimensions

The 2 following figures describe the sensor fusion platform dimensions and recommended assembly footprint.

The Module thickness is max 2.1mm (at BMX055 sensor location).

Fig. 13 Reference outline dimensions (top view, component side)

www.emmicroelectronic.com

7180SFP-DS Version 1.1, 10-Dec-14

420005-A01, 2.0

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