Datasheet > EFOBMFREQ1E3

EFOBMFREQ1E3

更新时间： 2024-01-17 19:46:22

品牌	Logo	应用领域
松下 - PANASONIC		晶体谐振器
页数	文件大小	规格书
4页	457K
描述
Ceramic Resonator, 12MHz Min, 20MHz Max, CERAMIC PACKAGE-3

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中文翻译

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技术参数
数据手册

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EFOBMFREQ1E3 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	CERAMIC PACKAGE-3	Reach Compliance Code：	unknown
风险等级：	5.82	其他特性：	TAPE AND REEL; BULIT-IN CAPACITOR
晶体/谐振器类型：	CERAMIC RESONATOR	频率稳定性：	0.3%
频率容差：	3000 ppm	JESD-609代码：	e3/e4
安装特点：	SURFACE MOUNT	最大工作频率：	20 MHz
最小工作频率：	12 MHz	最高工作温度：	80 °C
最低工作温度：	-20 °C	物理尺寸：	L4.1XB2.9XH1.2 (mm)/L0.161XB0.114XH0.047 (inch)
表面贴装：	YES	端子面层：	TIN/GOLD
Base Number Matches：	1

EFOBMFREQ1E3 数据手册

Ceramic Resonators (Chip Type)

Ceramic Resonators, Chip Type

(3 Array Type)

Type: EFOS

Type: EFOB

Type: EFOSS

Type: EFOSM

Type: EFOBM

Type: EFOJM

■ Recommended Applications

■ Features

■ Clock generator for microprocessors

■ Encased in a ceramic package

■ High reliability against soldering heat and mechanical

stress

■ Carrier circuit between telecommunication equipment

(Telephone to telephone, personal computer to printer)

■ Moisture-proof sealing

■ Safety Precautions (See Page 237 to 238)

■ 1.2 mm maximum in thickness (SS/SM/BM/JM)

■ Designed for reflow soldering

■ Flat-bottom plate for better mountings

■ Simplifies oscillation circuits by reducing the number

of circuit parts

■ Explanation of Part Numbers

Frequency range

(MHz)

Frequency Temperature Characteristics Built-in Capacitors

Part Number

EFOS

Note

(-20 to +80 °C)

(Reference)

2.00 to 8.39

8.40 to 13.0

13.1 to 20.0

4.00 to 8.39

8.40 to 13.0

4.00 to 8.39

8.40 to 13.0

12.0 to 20.0

16.0 to 20.0

30.0 to 50.0

±0.2 %

±1.0 %

±0.5 %

±0.2 %

±0.3 %

±0.2 %

±1.0 %

±0.3 %

±0.5 %

±0.2 %

33 pF

Product weight 0.110 g/pcs.

EFOB

33 pF

21 pF

Product weight 0.072 g/pcs.

Product weight 0.028 g/pcs.

EFOSS

EFOSM

33 pF

Product weight 0.077 g/pcs.

EFOBM

EFOJM

18 pF

10 pF

Product weight 0.035 g/pcs.

Product weight 0.050 g/pcs.

Mar. 2005

12 3 4

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