Photomicrosensor (Transmissive)
EE-SX1330
Ultra-Compact Slot / SMD Type
(Slot width: 3 mm)
• PCB surface mounting type.
• High resolution with a 0.3-mm-wide aperture.
Be sure to read Safety Precautions on page 3.
Ordering Information
Photomicrosensor
Sensing
method
Connecting
method
Aperture size (H × W)
(mm)
Appearance
Sensing distance
Output type
Model
Emitter
1.4 × 1.4
5
Transmissive
(slot type)
3 mm
SMT
Phototransistor
EE-SX1330
(slot width)
4
Detector
1 × 0.3
6
Ratings, Characteristics and Exterior Specifications
Absolute Maximum Ratings (Ta = 25°C)
Electrical and Optical Characteristics (Ta = 25°C)
Item
Symbol
Rated value
Unit
Value
Item
Symbol
Unit Condition
MIN. TYP. MAX.
Emitter
Emitter
Forward current
IF
25 *1
100 *2
5
mA
mA
V
Forward current
VF
IR
---
---
1.1
---
1.3
10
V
IF = 5 mA
Pulse forward current
Reverse voltage
IFP
VR
μA VR = 5 V
Reverse current
Peak emission
wavelength
Detector
λP
---
940
---
nm IF = 20 mA
Collector-Emitter
voltage
VCEO
VECO
12
5
V
V
Detector
IF = 5 mA,
μA
Emitter-Collector
voltage
Light current
Dark current
IL
100
---
---
10
900
100
0.4
VCE = 5 V
VCE = 10 V,
0 lx
IC
20
mA
mW
°C
ID
nA
Collector current
Collector dissipation
Operating temperature
Storage temperature
PC
75 *1
VCE
(sat)
IF = 20 mA,
V
Collector-Emitter
saturated voltage
---
0.1
IL = 100 μA
Topr
Tstg
-30 to +85 *1
-40 to +90 *1
°C
Peak spectral
sensitivity
wavelength
λP
tr
---
---
---
900
19
---
---
---
nm VCE = 5 V
Reflow soldering
temperature
Tsol
255 *3
°C
VCC = 5 V,
RL = 100 Ω,
IL = 500 μA
*1. Refer to the temperature rating chart if the ambient temperature
exceeds 25°C.
*2. Duty ratio: 1%, Pulse width: 0.1 ms
*3. Complete soldering within 10 seconds for reflow soldering.
Rising time
μs
μs
VCC = 5 V,
RL = 100 Ω,
IL = 500 μA
Falling time
tf
26
Exterior Specifications
Note: Refer to the following timing diagram for tr and tf.
Material
I L
Connecting method
Weight (g)
V
Input
cc
Case
Input
0
SMT
0.2
PPS
t
Output
RL
90%
Output
10%
0
t
tr
tf
1