Datasheet > ECP053G

ECP053G

更新时间： 2024-02-28 22:00:24

品牌	Logo	应用领域
WJCI		放大器射频微波
页数	文件大小	规格书
3页	147K
描述
1/2 Watt, High Linearity InGaP HBT Amplifier

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ECP053G 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	compliant	风险等级：	5.65
特性阻抗：	50 Ω	构造：	COMPONENT
增益：	10.5 dB	最大输入功率 (CW)：	22 dBm
JESD-609代码：	e4	最大工作频率：	2700 MHz
最小工作频率：	2300 MHz	最高工作温度：	85 °C
最低工作温度：	-40 °C	射频/微波设备类型：	NARROW BAND MEDIUM POWER
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)	Base Number Matches：	1

ECP053G 数据手册

The Communications Edge ^TM

ECP053

1/2 Watt, High Linearity InGaP HBT Amplifier

Product Information

ECP053G (SOIC-8 Package) Mechanical Information

Outline Drawing Product Marking

The component will be marked with an

“ECP053G” designator with an alphanumeric

lot code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating: Class 1B

Value:

Test:

Standard:

Passes between 500 and 1000V

Human Body Model (HBM)

JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +235° C convection reflow

Standard: JEDEC Standard J-STD-020

Functional Diagram

Land Pattern

Function

Vref

Input

Pin No.

Output

Vbias

6, 7

GND

N/C or GND

Backside Paddle

2, 4, 5

Mounting Config. Notes

1. A heatsink underneath the area of the PCB for the mounted

device is strictly required for proper thermal operation.

Damage to the device can occur without the use of one.

2. Ground / thermal vias are critical for the proper performance

of this device. Vias should use a .35mm (#80 / .0135”)

diameter drill and have a final plated thru diameter of .25

mm (.010”).

3. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

4. Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

Thermal Specifications

MTTF vs. GND Tab Temperature

100000

10000

1000

Parameter

Rating

-40 to +85° C

62° C / W

162° C

Operating Case Temperature

Thermal Resistance, Rth ⁽¹⁾

Junction Temperature, Tjc ⁽²⁾

Notes:

5. Do not put solder mask on the backside of the PC board in

the region where the board contacts the heatsink.

6. RF trace width depends upon the PC board material and

construction.

1. The thermal resistance is referenced from the junction-

to-case at a case temperature of 85° C. Tjc is a function

of the voltage at pins 6 and 7 and the current applied to

pins 6, 7, and 8 and can be calculated by:

7. Use 1 oz. Copper minimum.

All dimensions are in millimeters (inches). Angles are in

degree

100

100 110 120

Tjc = Tcase + Rth * Vcc * Icc

Tab Temperature (°C)

2. This corresponds to the typical biasing condition of +5V,

250 mA at an 85° C case temperature. A minimum

MTTF of 1 million hours is achieved for junction

temperatures below 247° C.

Specifications and information are subject to change without notice

August 2004

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

123

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