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EBD11RD8ADFA-7B PDF预览

EBD11RD8ADFA-7B

更新时间: 2024-01-01 04:36:51
品牌 Logo 应用领域
尔必达 - ELPIDA 存储内存集成电路动态存储器双倍数据速率时钟
页数 文件大小 规格书
19页 160K
描述
1GB Registered DDR SDRAM DIMM

EBD11RD8ADFA-7B 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DIMM包装说明:DIMM,
针数:184Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.36
风险等级:5.84访问模式:DUAL BANK PAGE BURST
最长访问时间:0.75 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-XDMA-N184JESD-609代码:e4
内存密度:9663676416 bit内存集成电路类型:DDR DRAM MODULE
内存宽度:72功能数量:1
端口数量:1端子数量:184
字数:134217728 words字数代码:128000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128MX72
封装主体材料:UNSPECIFIED封装代码:DIMM
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度):260认证状态:Not Qualified
自我刷新:YES最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子面层:Gold (Au)
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:50Base Number Matches:1

EBD11RD8ADFA-7B 数据手册

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EBD11RD8ADFA  
Pin Functions  
CK, /CK (input pin)  
The CK and the /CK are the master clock inputs. All inputs except DMs, DQSs and DQs are referred to the cross  
point of the CK rising edge and the VREF level. When a read operation, DQSs and DQs are referred to the cross  
point of the CK and the /CK. When a write operation, DMs and DQs are referred to the cross point of the DQS and  
the VREF level. DQSs for write operation are referred to the cross point of the CK and the /CK.  
/CS (input pin)  
When /CS is low, commands and data can be input. When /CS is high, all inputs are ignored. However, internal  
operations (bank active, burst operations, etc.) are held.  
/RAS, /CAS, and /WE (input pins)  
These pins define operating commands (read, write, etc.) depending on the combinations of their voltage levels.  
See "Command operation".  
A0 to A12 (input pins)  
Row address (AX0 to AX12) is determined by the A0 to the A12 level at the cross point of the CK rising edge and the  
VREF level in a bank active command cycle. Column address (AY0 to AY9, AY11) is loaded via the A0 to the A9  
and the A11 at the cross point of the CK rising edge and the VREF level in a read or a write command cycle. This  
column address becomes the starting address of a burst operation.  
A10 (AP) (input pin)  
A10 defines the precharge mode when a precharge command, a read command or a write command is issued. If  
A10 = high when a precharge command is issued, all banks are precharged. If A10 = low when a precharge  
command is issued, only the bank that is selected by BA1, BA0 is precharged. If A10 = high when read or write  
command, auto-precharge function is enabled. While A10 = low, auto-precharge function is disabled.  
BA0, BA1 (input pin)  
BA0, BA1 are bank select signals (BA). The memory array is divided into bank 0, bank 1, bank 2 and bank 3. (See  
Bank Select Signal Table)  
[Bank Select Signal Table]  
BA0  
BA1  
Bank 0  
L
L
Bank 1  
H
L
L
Bank 2  
H
H
Bank 3  
H
Remark: H: VIH. L: VIL.  
CKE (input pin)  
CKE controls power down and self-refresh. The power down and the self-refresh commands are entered when the  
CKE is driven low and exited when it resumes to high.  
The CKE level must be kept for 1 CK cycle at least, that is, if CKE changes at the cross point of the CK rising edge  
and the VREF level with proper setup time tIS, at the next CK rising edge CKE level must be kept with proper hold  
time tIH.  
DQ, CB (input and output pins)  
Data are input to and output from these pins.  
DQS (input and output pin)  
DQS provide the read data strobes (as output) and the write data strobes (as input).  
Preliminary Data Sheet E0441E10 (Ver. 1.0)  
15  

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