DATA S HEET
MINIATURE SIGNAL RELAY
EB2 SERIES
COMPACT AND LIGHT WEIGHT
SURFACE MOUNTING TYPE
DESCRIPTION
The EB2 series is a version of the EA2 series, suitable for surface m ounting with infrared soldering (lRS) and
vapor phase soldering (VPS). This series has three variations of high solder joint reliability type, and low profile
type.
FEATURES
™ Com pact and lightweight : 7.5 m m × 14.3 m m × 9.3 m m , 1.5 g
™ 2 form c contact arrangem ent
™ Low power consum ption
™
Low m agnetic interference
™ Breakdown voltage: 1 000 VAC (surge voltage 1 500 V), FCC Part 68 conform able
™ UL recognized (E73266), CSA certified (LR 46266)
™ Lineup in non-latch, single-coil latch and double-coil latch types
™ Lineup in m inim um footprint (9.3 × 14.3), and high solder joint reliability (20 years) types
™ Lineup in low profile type (hight : 6.5 m m ), and Ultra-low profile (hight : 5.6 m m )
APPLICATIONS
Electronic switching systems, PBX, key telephone systems, automatic test equipment and other electronic equipment.
ATTENTION
DO NOT EXCEED MAXIMUM RATINGS.
Do not use relays under exceeding conditions such as over ambient temperature, over voltage and over
current. Incorrect use could result in abnormal heating, damage to related parts or cause burning.
READ CAUTIONS IN THE SELECTION GUIDE.
Read the cautions described in NEC's "Miniature Relays" (ER0046EJ ) when you choose relays for
your application.
The inform ation in this docum ent is subject to change w ithout notice.
Docum ent No. ER0016EJ 5V0DS00 (5th edition)
Date Published February 1999 M
Printed in J apan
©
1994